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1. WO2007146676 - PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD

Publication Number WO/2007/146676
Publication Date 21.12.2007
International Application No. PCT/US2007/070423
International Filing Date 05.06.2007
IPC
B41J 2/14 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
14Structure thereof
CPC
B41J 2/14201
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
14Structure thereof ; only for on-demand ink jet heads
14201Structure of print heads with piezoelectric elements
B41J 2002/14362
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
14Structure thereof ; only for on-demand ink jet heads
14362Assembling elements of heads
Y10T 156/10
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
10Methods of surface bonding and/or assembly therefor
Applicants
  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US]/[US] (AllExceptUS)
  • KARLINSKI, Haggai [IL]/[IL] (UsOnly)
  • FISHER, Gil [IL]/[IL] (UsOnly)
  • NATHAN, Roi [IL]/[IL] (UsOnly)
  • WEISS, Ilan [IL]/[IL] (UsOnly)
Inventors
  • KARLINSKI, Haggai
  • FISHER, Gil
  • NATHAN, Roi
  • WEISS, Ilan
Agents
  • COULMAN, Donald, J.
Priority Data
11/447,33306.06.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD
(FR) tête d'impression avec une contrainte de collage réduite et procédé
Abstract
(EN)
An ink jet print head (100) includes a silicon ink jet chip (104), a print head holder (102), configured to carry and support the silicon chip, and a glass plate (118), bonded between the silicon chip and the print head holder. The ink jet chip (104) has a coefficient of thermal expansion αs. The print head holder (102) has a holder wall thickness, and a coefficient of thermal expansion ah that is substantially different from αs. The glass plate (118) has a coefficient of thermal expansion αg that is substantially similar to αs, and a thickness at least as great as the holder wall thickness, whereby stress created by differential thermal expansion between the silicon chip (104) and the holder (102) is attenuated by the glass plate.
(FR)
L'invention concerne une tête d'impression (100) à jet d'encre comprenant une puce à jet d'encre de silicium (104), un support de tête d'impression (102), configuré pour porter et soutenir la puce de silicium, et une plaque de verre (118), collée entre la puce de silicium et le support de tête d'impression. La puce à jet d'encre (104) a un coefficient d'expansion thermique αs. Le support de tête d'impression (102) a une épaisseur de paroi de support et un coefficient d'expansion thermique ah qui est sensiblement différent de αs. La plaque de verre (118) a un coefficient d'expansion thermique αg qui est sensiblement similaire à αs, et une épaisseur au moins aussi importante que l'épaisseur de paroi de support, de telle manière qu'une contrainte créée par une expansion thermique différentielle entre la puce de silicium (104) et le support (102) est atténuée par la plaque de verre.
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