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1. WO2007145433 - SEMICONDUCTOR DEVICE AND TOUCH SENSOR DEVICE

Publication Number WO/2007/145433
Publication Date 21.12.2007
International Application No. PCT/KR2007/002567
International Filing Date 28.05.2007
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
CPC
G06F 3/044
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044by capacitive means
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/48257
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48257connecting the wire to a die pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
Applicants
  • ATLAB INC. [KR]/[KR] (AllExceptUS)
  • JUNG, Duck-Young [KR]/[KR] (UsOnly)
  • CHUNG, Jin-Woo [KR]/[KR] (UsOnly)
  • LEE, Bang-Won [KR]/[KR] (UsOnly)
Inventors
  • JUNG, Duck-Young
  • CHUNG, Jin-Woo
  • LEE, Bang-Won
Agents
  • PARK, Sang-soo
Priority Data
10-2006-005318913.06.2006KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE AND TOUCH SENSOR DEVICE
(FR) DISPOSITIF SEMI-CONDUCTEUR ET DISPOSITIF TACTILE
Abstract
(EN)
Provided are a semiconductor device and a touch sensor device. The semiconductor device includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object comes into contact with the package. The touch sensor device includes a plurality of semiconductor devices connected in a daisy-chain communication mode, wherein each of the semiconductor devices includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object is brought into contact with the package. The semiconductor device enables the size and position of a touch pad to be known in advance during the fabrication of a die so that a sensitivity adjusting process can be simplified. Also, since the touch pad is included in a touch sensor, a system can be simply configured at low cost. Furthermore, the touch sensor device requires no additional sensitivity adjusting process and enables a plurality of touch sensor systems to be constructed at low cost by simply connecting a small number of electrical signals.
(FR)
La présente invention concerne un dispositif semi-conducteur et un dispositif tactile. Le dispositif semi-conducteur comprend une puce comprenant un générateur de signal sensitif servant à détecter un signal tactile pour générer un signal sensitif ; une pastille d'attache de puce conductrice fixée à la puce pour générer le signal tactile ; et un emballage servant à emballer la puce et la pastille d'attache de puce. La pastille d'attache de puce génère le signal tactile si un objet tactile entre en contact avec l'emballage. Le dispositif tactile comprend une pluralité de dispositifs semi-conducteurs connectés en mode de communication en guirlande. Chacun des dispositifs semi-conducteurs comprend une puce comprenant un générateur de signal sensitif servant à détecter un signal tactile pour générer un signal sensitif ; une pastille d'attache de puce conductrice fixée à la puce pour générer le signal tactile ; et un emballage servant à emballer la puce et la pastille d'attache de puce. La pastille d'attache de puce génère le signal tactile si un objet tactile est mis en contact avec l'emballage. Le dispositif semi-conducteur permet de connaître à l'avance la taille et la position d'un bloc tactile pendant la fabrication d'une puce, ce qui permet de simplifier le processus d'ajustement de la sensibilité. De plus, comme le bloc tactile est compris dans un capteur tactile, un tel système peut être configuré simplement et économiquement. En outre, le dispositif tactile ne nécessite aucun processus d'ajustement de sensibilité supplémentaire et permet de réaliser économiquement une pluralité de systèmes tactiles en connectant simplement un petit nombre de signaux électriques.
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