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1. WO2007145315 - SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE CONVEYANCE METHOD

Publication Number WO/2007/145315
Publication Date 21.12.2007
International Application No. PCT/JP2007/062101
International Filing Date 15.06.2007
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/6719
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
6719characterized by the construction of the processing chambers, e.g. modular processing chambers
H01L 21/67196
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67196characterized by the construction of the transfer chamber
H01L 21/67225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67207comprising a chamber adapted to a particular process
67225comprising at least one lithography chamber
H01L 21/67745
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67745characterized by movements or sequence of movements of transfer devices
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP] (AllExceptUS)
  • 山本 雄一 YAMAMOTO, Yuichi [JP]/[JP] (UsOnly)
Inventors
  • 山本 雄一 YAMAMOTO, Yuichi
Agents
  • 高山 宏志 TAKAYAMA, Hiroshi
Priority Data
2006-16562115.06.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE CONVEYANCE METHOD
(FR) SYSTÈME DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRANSPORT DE SUBSTRAT
(JA) 基板処理システムおよび基板搬送方法
Abstract
(EN)
A substrate processing system (100) comprises a main conveyance line (20) for conveying a wafer (W) over the entire system, and a sub-conveyance line (30) for conveying the wafer (W) in a photolithography processing section (1a). In the photolithography processing section (1a), a resist coating device (2) and a developing device (5) are arranged separately and a first exposure device (3a) and a first PEB device (4a), and a second exposure device (3b) and a second PEB device (4b) are respectively arranged adjacently.
(FR)
L'invention concerne un système de traitement de substrat (100) comprenant une ligne de transport principale (20) servant à transporter une plaquette (W) dans l'ensemble du système, et une ligne de transport secondaire (30) servant à transporter la plaquette (W) dans une section de traitement photolithographique (1a). Dans la section de traitement photolithographique (1a), un dispositif de revêtement d'enduit protecteur (2) et un dispositif de développement (5) sont disposés séparément et un premier dispositif d'exposition (3a) et un premier dispositif de PEB (4a) et un second dispositif d'exposition (3b) et un second dispositif de PEB (4b) sont respectivement disposés de façon adjacente.
(JA)
 基板処理システム(100)は、システムの全体にわたってウエハ(W)の搬送を行なう主搬送ライン(20)と、フォトリソグラフィー処理部(1a)内でのウエハ(W)の搬送を行なう副搬送ライン(30)とを備えている。フォトリソグラフィー処理部(1a)では、レジスト塗布処理装置(2)と現像処理装置(5)とが分離して配置され、第1の露光処理装置(3a)と第1のPEB処理装置(4a)、第2の露光処理装置(3b)と第2のPEB処理装置(4b)は隣接配置されている。
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