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1. WO2007145264 - THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, AND SOLID-STATE IMAGING DEVICE

Publication Number WO/2007/145264
Publication Date 21.12.2007
International Application No. PCT/JP2007/061954
International Filing Date 07.06.2007
IPC
C08G 59/20 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
C08K 5/3475 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3472Five-membered rings
3475condensed with carbocyclic rings
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
G03F 7/11 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
09characterised by structural details, e.g. supports, auxiliary layers
11having cover layers or intermediate layers, e.g. subbing layers
H01L 27/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
CPC
C08K 5/005
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
005Stabilisers against oxidation, heat, light, ozone
C08K 5/3475
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3472Five-membered rings
3475condensed with carbocyclic rings
G03F 7/0007
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
0007Filters, e.g. additive colour filters; Components for display devices
G03F 7/091
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
09characterised by structural details, e.g. supports, auxiliary layers
091characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
H01L 27/14621
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
1462Coatings
14621Colour filter arrangements
H01L 27/14627
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14625Optical elements or arrangements associated with the device
14627Microlenses
Applicants
  • JSR株式会社 JSR CORPORATION [JP]/[JP] (AllExceptUS)
  • 吉澤 純司 YOSHIZAWA, Junji [JP]/[JP] (UsOnly)
Inventors
  • 吉澤 純司 YOSHIZAWA, Junji
Agents
  • 大島 正孝 OHSHIMA, Masataka
Priority Data
2006-16329213.06.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, AND SOLID-STATE IMAGING DEVICE
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE, PROCÉDÉ DE FORMATION D'UN FILM ANTIHALO DE DISPOSITIF DE FORMATION D'IMAGE À L'ÉTAT SOLIDE, FILM ANTIHALO DE DISPOSITIF DE FORMATION D'IMAGE À L'ÉTAT SOLIDE, ET DISPOSITIF DE FORMATION D'IMAGE À L'ÉTAT SOLIDE
(JA) 熱硬化性樹脂組成物、固体撮像素子のハレーション防止膜の形成方法、固体撮像素子のハレーション防止膜、ならびに固体撮像素子
Abstract
(EN)
Disclosed is a thermosetting resin composition containing a polymer having a methylglycidyl group and an ultraviolet absorbent. This thermosetting resin composition enables to form an antihalation film which is excellent in storage stability, and capable of effectively suppressing diffused reflection light from the foundation substrate during an exposure process for forming a color filter or microlens for solid-state imaging devices. The antihalation film has high heat resistance, and does not have a rough surface even when it is subjected to dry etching.
(FR)
La présente invention concerne une composition de résine thermodurcissable contenant un polymère ayant un groupe méthylglycidyle et un absorbant d'ultraviolets. Cette composition de résine thermodurcissable permet de former un film antihalo qui est excellent en termes de stabilité de stockage et en mesure de supprimer de manière efficace la lumière de réflexion diffusée en provenance du substrat de base durant un procédé d'exposition pour former un filtre coloré ou une micro-lentille pour des dispositifs de formation d'image à l'état solide. Le film antihalo a une forte résistance à la chaleur et n'a pas de surface rugueuse même lorsqu'il est soumis à une gravure sèche.
(JA)
メチルグリシジル基を有する重合体と紫外線吸収剤を含有する熱硬化性樹脂組成物。この熱硬化性樹脂組成物は、保存安定性に優れるとともに、固体撮像素子におけるカラーフィルターやマイクロレンズを形成する際の露光工程において、下地基板からの乱反射光を効果的に抑制でき、かつ高度の耐熱性を有し、 ドライエッチングでも膜荒れが発生しないハレーション防止膜を形成する
Also published as
EP2007745214
Latest bibliographic data on file with the International Bureau