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1. WO2007144322 - METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A CARRIER

Publication Number WO/2007/144322
Publication Date 21.12.2007
International Application No. PCT/EP2007/055701
International Filing Date 11.06.2007
Chapter 2 Demand Filed 14.04.2008
IPC
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
CPC
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 2201/0347
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
H05K 2203/025
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
025Abrading, e.g. grinding or sand blasting
H05K 2203/0257
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
0257Brushing, e.g. cleaning the conductive pattern by brushing or wiping
H05K 2203/0789
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
07Treatments involving liquids, e.g. plating, rinsing
0779characterised by the specific liquids involved
0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
0789Aqueous acid solution, e.g. for cleaning or etching
H05K 2203/0796
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
07Treatments involving liquids, e.g. plating, rinsing
0779characterised by the specific liquids involved
0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
0796Oxidant in aqueous solution, e.g. permanganate
Applicants
  • BASF SE [DE]/[DE] (AllExceptUS)
  • LOCHTMAN, Rene [NL]/[DE] (UsOnly)
  • KACZUN, Jürgen [DE]/[DE] (UsOnly)
  • SCHNEIDER, Norbert [DE]/[DE] (UsOnly)
  • PFISTER, Jürgen [DE]/[DE] (UsOnly)
  • WAGNER, Norbert [DE]/[DE] (UsOnly)
  • HENTSCHEL, Dieter [DE]/[DE] (UsOnly)
Inventors
  • LOCHTMAN, Rene
  • KACZUN, Jürgen
  • SCHNEIDER, Norbert
  • PFISTER, Jürgen
  • WAGNER, Norbert
  • HENTSCHEL, Dieter
Agents
  • HÖRSCHLER, Wolfram
Priority Data
06115487.814.06.2006EP
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG VON ELEKTRISCH LEITFÄHIGEN OBERFLÄCHEN AUF EINEM TRÄGER
(EN) METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A CARRIER
(FR) PROCÉDÉ DE FABRICATION DE SURFACES ÉLECTRIQUEMENT CONDUCTRICES SUR UN SUPPORT
Abstract
(DE)
Verfahren zur Herstellung von elektrisch leitfähigen, strukturierten oder vollflächigen Oberflächen auf einem Träger, bei welchem in einem ersten Schritt eine strukturierte oder vollflächige Basisschicht auf den Träger mit einer Dispersion, die elektrisch leitfähige Partikel in einem Matrixmaterial enthält, aufgetragen wird, in einem zweiten Schritt das Matrixmaterial zumindest teilweise aushärtet oder trocknet, in einem dritten Schritt die elektrisch leitfähigen Partikel durch zumindest teilweises Aufbrechen der Matrix freigelegt werden und in einem vierten Schritt eine Metallschicht auf der strukturierten oder vollflächigen Basisschicht durch stromlose oder galvanische Beschichtung ausgebildet wird.
(EN)
Method for producing electrically conductive, structured or whole-area surfaces on a carrier, in which a first step involves applying a structured or whole-area base layer to the carrier with a dispersion containing electrically conductive particles in a matrix material, a second step involves at least partly curing or drying the matrix material, a third step involves uncovering the electrically conductive particles by at least partly breaking up the matrix, and a fourth step involves forming a metal layer on the structured or whole-area base layer by means of electroless or electrolytic coating.
(FR)
La présente invention concerne un procédé de fabrication de surfaces électriquement conductrices structurées ou en pleine surface sur un support, dont une première étape consiste à appliquer sur le support une couche de base structurée ou en pleine surface avec une dispersion qui contient des particules électriquement conductrices avec un matériau matriciel, dont une deuxième étape consiste à faire durcir ou sécher au moins partiellement le matériau matriciel, dont une troisième étape consiste à libérer les particules électriquement conductrices en brisant au moins partiellement la matrice et dont une quatrième étape consiste à appliquer par revêtement galvanique ou autocatalytique une couche métallique sur la couche de base structurée ou en pleine surface.
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