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1. WO2007143566 - FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP

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[ EN ]

What is claimed is:

1. An apparatus for supporting a substrate, comprising:
a base member having a bottom surface configured to provide support to the substrate and a plurality of recesses formed therein, the plurality of recesses open to the bottom surface; and
a flexible membrane mounted on the base member covering the bottom surface, wherein a center chamber is formed between at least a portion of the bottom surface of the base member and the flexible membrane, the center chamber may be deflated by a vacuum source, and an outer surface of the flexible membrane is configured to receive the substrate thereon.

2. The apparatus of claim 1 , wherein an edge chamber is formed between the flexible membrane and an edge of the base member.

3. The apparatus of claim 2, wherein the edge chamber may be inflated and deflated independently from the center chamber.

4. The apparatus of claim 1 , wherein the center chamber may be inflated or deflated by pumping in or out a control gas through a passage formed in the base member.

5. The apparatus of claim 1 , wherein the base member is vertically movable.

6. A method for loading a substrate, comprising:
providing a base member configured to provide support to the substrate;
providing a flexible membrane mounted on the base member, wherein the flexible membrane forms a center chamber with the base member;
pushing the substrate against flexible membrane to assist venting of the center chamber; and
vacuum chucking the substrate to the flexible membrane by pumping out the center chamber.

7. The method of claim 6, wherein the flexible membrane forms an edge chamber around the base member.

8. The method of claim 7, further comprising, prior to vacuum chucking the substrate, inflating the edge chamber to form a seal between the substrate and the flexible membrane.

9. The method of claim 7, further comprising, prior to pushing the substrate, venting the center chamber and the edge chamber.

10. The method of claim 6, further comprising, prior to pushing the substrate, venting the center chamber.

11. The method of claim 6, wherein pushing the substrate is performed using a controlled force.

12. The method of claim 6, wherein pushing the substrate against the flexible membrane comprises pushing the substrate until the flexible membrane is in contact with a bottom surface of the base member.

13. The method of claim 6, further comprising providing a substrate support configured to push the substrate against the flexible membrane.

14. A method for vacuum chucking a substrate, comprising:
venting a center chamber of a flexible membrane configured for mounting the substrate;
moving the substrate such that a backside of the substrate is in full contact with the flexible membrane; and
vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

15. The method of claim 14, further comprising positioning a substrate on a substrate support in a face down position.

16. The method of claim 15, wherein moving the substrate comprises:
raising the substrate towards the flexible membrane; and
pushing the substrate against the flexible membrane to force venting the center chamber.

17. The method of claim 16, wherein raising and pushing the substrate is performed by the substrate support.

18. The method of claim 14, further comprising venting an edge chamber of the flexible membrane while venting the center chamber.

19. The method of claim 18, further comprising, prior to vacuuming the center chamber, inflating the edge chamber to form a seal between the substrate and the flexible membrane.

20. The method of claim 14, further comprising stopping the substrate when a predetermined force is applied to the substrate by the flexible membrane.