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1. WO2007142788 - LASER ABLATION RESIST

Publication Number WO/2007/142788
Publication Date 13.12.2007
International Application No. PCT/US2007/011626
International Filing Date 15.05.2007
IPC
G03F 1/00 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
B23K 26/40 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
CPC
G03F 1/00
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
1Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
Y10S 430/145
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
430Radiation imagery chemistry: process, composition, or product thereof
145Infrared
Y10S 430/146
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
430Radiation imagery chemistry: process, composition, or product thereof
146Laser beam
Applicants
  • EASTMAN KODAK COMPANY [US]/[US] (AllExceptUS)
  • PHILLIPS, Scott E. [US]/[US] (UsOnly)
  • TREDWELL, Timothy John [US]/[US] (UsOnly)
  • TUTT, Lee W. [US]/[US] (UsOnly)
  • PEARCE, Glenn Thomas [US]/[US] (UsOnly)
  • NGUYEN, Kelvin [US]/[US] (UsOnly)
  • WEXLER, Ronald Myron [US]/[US] (UsOnly)
Inventors
  • PHILLIPS, Scott E.
  • TREDWELL, Timothy John
  • TUTT, Lee W.
  • PEARCE, Glenn Thomas
  • NGUYEN, Kelvin
  • WEXLER, Ronald Myron
Common Representative
  • EASTMAN KODAK COMPANY
Priority Data
11/420,81730.05.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LASER ABLATION RESIST
(FR) RÉsine photosensible pour ablation laser
Abstract
(EN)
A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.
(FR)
L'invention concerne un procédé de fabrication de dispositifs microstructurés par dépôt d'une première couche de résine photosensible (12) sur un substrat (10). Un motif est créé sur le substrat par retrait thermique induit par irradiation de la résine photosensible.
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