Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Saturday 31.10.2020 at 7:00 AM CET
Settings

Settings

Goto Application

1. WO2007140463 - SOLDERABLE PADS UTILIZING NICKEL AND SILVER NANOPARTICLE INK JET INKS

Publication Number WO/2007/140463
Publication Date 06.12.2007
International Application No. PCT/US2007/070112
International Filing Date 31.05.2007
IPC
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
CPC
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 2201/0257
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0242Shape of an individual particle
0257Nanoparticles
H05K 2201/035
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
035Paste overlayer, i.e. conductive paste or solder paste over conductive layer
H05K 2203/013
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
013Inkjet printing, e.g. for printing insulating material or resist
H05K 2203/1476
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
14Related to the order of processing steps
1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
H05K 3/125
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using ; thick film techniques, e.g.; printing techniques to apply the conductive material ; or similar techniques for applying conductive paste or ink patterns
1241by ink-jet printing or drawing by dispensing
125by ink-jet printing
Applicants
  • CABOT CORPORATION [US]/[US] (AllExceptUS)
  • HOWARTH, James, J. [US]/[US] (UsOnly)
  • JAMES, Anthony, R. [US]/[US] (UsOnly)
  • VANHEUSDEN, Karel [BE]/[US] (UsOnly)
Inventors
  • HOWARTH, James, J.
  • JAMES, Anthony, R.
  • VANHEUSDEN, Karel
Agents
  • PATENT ADMINISTRATOR
Priority Data
11/443,26531.05.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SOLDERABLE PADS UTILIZING NICKEL AND SILVER NANOPARTICLE INK JET INKS
(FR) Languettes soudables utilisant des encres pour jet d'encre À nanoparticules de nickel et d'argent
Abstract
(EN)
A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.
(FR)
L'invention concerne un système et un procédé pour l'impression par jet d'encre d'une languette conductrice soudable sur un substrat. Le système comprend au moins une tête d'impression et un poste de séchage pour durcir une encre déposée sur le substrat. Le système est conçu pour déposer au moins une première couche d'une première encre sur le substrat, durcir la première couche de première encre, déposer au moins une couche intermédiaire d'une deuxième encre au-dessus de première couche durcie de première encre, durcir la couche intermédiaire de deuxième encre, déposer au moins une dernière couche de première encre au-dessus de la couche intermédiaire durcie de deuxième encre, et durcir la dernière couche de première encre. La première encre possède une conductivité relativement élevée, la deuxième une conductivité relativement basse. La première couche, la couche intermédiaire et la dernière couche peuvent être disposées pour empêcher qu'une brasure appliquée à la dernière couche diffuse jusqu'à la première couche.
Latest bibliographic data on file with the International Bureau