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1. WO2007140365 - SOLDER FLUX COMPOSITION

Publication Number WO/2007/140365
Publication Date 06.12.2007
International Application No. PCT/US2007/069882
International Filing Date 29.05.2007
IPC
B23K 35/36 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
B23K 35/3618
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
36Selection of non-metallic compositions, e.g. coatings, fluxes
3612with organic compounds as principal constituents
3618Carboxylic acids or salts
H05K 3/3489
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Applicants
  • INTEL CORPORATION [US]/[US] (AllExceptUS)
  • PRAKASH, Anna [IN]/[US] (UsOnly)
  • LEBONHEUR, Vassoudevane [US]/[US] (UsOnly)
  • LEHMAN, Stephen [US]/[US] (UsOnly)
  • KONING, Paul [US]/[US] (UsOnly)
Inventors
  • PRAKASH, Anna
  • LEBONHEUR, Vassoudevane
  • LEHMAN, Stephen
  • KONING, Paul
Agents
  • AUYEUNG, Aloysius T.c.
Priority Data
11/444,73831.05.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SOLDER FLUX COMPOSITION
(FR) COMPOSITION DE FLUX DE BRASURE
Abstract
(EN)
A composition, a method, and a system for a solder flux are disclosed herein. In various embodiments, a solder flux composition may comprise a surfactant and less than about 20% of a carboxylic acid. In some of these embodiments, the solder flux composition may be used in lead-free soldering processes.
(FR)
L'invention concerne une composition, une méthode, et un système destinés à un flux de brasure. Dans des modes de réalisation de l'invention, une composition de flux de brasure comprend un surfactant et moins de 20% environ d'acide carboxylique. Dans certains modes de réalisation, la composition de flux de brasure peut être utilisée dans des procédés de soudure sans plomb.
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