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1. WO2007140336 - STATIC DISSIPATIVE LAYER SYSTEM AND METHOD

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[ EN ]

Claims
What is claimed is:

1. An apparatus comprising:

a plurality of test pins;
a static dissipative layer having a plurality of openings; and
a plurality of support features coupled to the static dissipative layer to movably support the static dissipative layer at a first and a second relative position, to enable the static dissipative layer to make initial contact with terminals of a component to be tested to discharge static, if any, built up at the terminals of the component while the static dissipative layer is supported at the first relative position, and to enable the static dissipative layer to expose the test pins through the openings to make contact with the terminals of the component after the static dissipative layer had made initial contact with the terminals of the component at the first relative position, the plurality of openings being substantially aligned with the test pins when the static dissipative layer is supported at the second relative position.

2. The apparatus of claim 1 wherein the plurality of support features include a bias designed to bias one or both of the static dissipative layer and the plurality of test pins toward the first relative position.

3. The apparatus of claim 2 wherein the bias has a bias force strong enough to support the component, and further comprising a pushing member designed to

push the static dissipative layer toward the test pins against the bias.

4. The apparatus of claim 2 wherein the bias has a bias force such that the weight of the component pushes the static dissipative layer toward the test pins.

5. The apparatus of claim 1 wherein the plurality of openings are inverted frustoconically shaped.

6. The apparatus of claim 1 wherein the static dissipative layer has a plurality of protrusions adjacent the plurality of openings designed to contact the terminals to dissipate a static charge, if present, from the terminals.

7. The apparatus of claim 1 further comprising a base designed to hold the plurality of test pins, and wherein the static dissipative layer has two tabs extending from opposite edges thereof, and the plurality of support features include a bias member disposed between each of the two tabs and the base biasing the static dissipative layer and the plurality of test pins toward the first relative position.

8. The apparatus of claim 1 wherein the static dissipative layer is coupled with a ground on a test circuit designed to test the component.

9. A method comprising:
placing a component to be tested in a test apparatus having a number of test pins, and a static dissipative layer movably supported over the test pins, where the static dissipative layer makes initial contact with terminals of the component to substantially discharge static, if any, built up at the terminals of the component, before exposing the test pins to contact the terminals of the component; and
testing the component.

10. The method of claim 9 further comprising biasing one or both of the static dissipative layer and the test pins away from each other.

11. The method of claim 9 further comprising forming a number of inverted frustoconical openings in the static dissipative layer sized to allow the test pins to pass through and contact the terminals.

12. The method of claim 9 further comprising forming a number of protrusions on the static dissipative layer disposed to contact the terminals.

13. The method of claim 9 further comprising coupling the static dissipative layer with a ground on a test circuit designed to test the component.

14. A system comprising:
a tester having a socket adapted to receive a component for testing, the socket having a plurality of test pins, a static dissipative layer having a plurality of openings, a plurality of support features coupled to the static dissipative layer to movably support the static dissipative layer at a first and a second relative position, to enable the static dissipative layer to make initial contact with terminals of a component to be tested to discharge static, if any, built up at the terminals of the component while the static dissipative layer is supported at the first relative position, and to enable the static dissipative layer to expose the test pins through the openings to make contact with the terminals of the component after the static dissipative layer had made initial contact with the terminals of the component at the first relative position, the plurality of openings being substantially aligned with the test pins when the static dissipative layer is supported at the second relative position; and
a power supply unit coupled to the tester to provide DC power to the tester.

15. The system of claim 14 wherein the plurality of support features include a bias designed to bias one or both of the static dissipative layer and the plurality of test pins toward the first relative position.

16. The system of claim 15 wherein the bias has a bias force strong enough to support the component, and further comprising a pushing member designed to push the static dissipative layer toward the test pins against the bias.

17. The system of claim 14 wherein the plurality of openings are inverted frustoconically shaped.

18. The system of claim 14 wherein the static dissipative layer has a plurality of protrusions adjacent the plurality of openings designed to contact the terminals to dissipate a static charge, if present, from the terminals.

19. The system of claim 14 wherein the socket includes a base designed to hold the plurality of test pins, and wherein the static dissipative layer has two tabs extending from opposite edges thereof, and the plurality of support features include a bias member disposed between each of the two tabs and the base biasing the static dissipative layer and the plurality of test pins toward the first relative position.

20. The system of claim 14 wherein the static dissipative layer is coupled with a ground on a test circuit designed to test the component.