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1. WO2007140336 - STATIC DISSIPATIVE LAYER SYSTEM AND METHOD

Publication Number WO/2007/140336
Publication Date 06.12.2007
International Application No. PCT/US2007/069799
International Filing Date 25.05.2007
IPC
G01R 31/26 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
CPC
G01R 1/0433
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
G01R 1/0466
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
0466concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 1/36
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
36Overload protection arrangements or circuits for electric measuring instruments
H01R 13/6485
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
648Protective earth or shield arrangements on coupling devices ; , e.g. anti-static shielding;  
6485Electrostatic discharge protection
H05K 9/0067
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
0067Devices for protecting against damage from electrostatic discharge
Applicants
  • INTEL CORPORATION [US]/[US] (AllExceptUS)
  • DELA CRUZ, Warly [PH]/[PH] (UsOnly)
  • HINTAY, Charlene [PH]/[PH] (UsOnly)
  • CONCORDIA, Jeffrey [PH]/[PH] (UsOnly)
Inventors
  • DELA CRUZ, Warly
  • HINTAY, Charlene
  • CONCORDIA, Jeffrey
Agents
  • AUYEUNG, Aloysius T.c.
Priority Data
11/441,57926.05.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) STATIC DISSIPATIVE LAYER SYSTEM AND METHOD
(FR) SYSTÈME ET PROCÉDÉ AVEC COUCHE DISSIPATRICE DE L'ÉLECTRICITÉ STATIQUE
Abstract
(EN)
An apparatus, system, and method is provided including a plurality of test pins, a static dissipative layer having a plurality of openings, and a plurality of support features coupled to the static dissipative layer to movably support the static dissipative layer at a first and a second relative position. The support features enable the static dissipative layer to make initial contact with terminals of a component to be tested to discharge static, if any, built up at the terminals of the component while the static dissipative layer is supported at the first relative position. The support features also enable the static dissipative layer to expose the test pins through the openings to make contact with the terminals of the component after the static dissipative layer had made initial contact with the terminals of the component at the first relative position.
(FR)
La présente invention concerne un appareil, un système et un procédé comprenant une pluralité de broches d'essai, une couche dissipatrice de l'électricité statique présentant une pluralité d'ouvertures et une pluralité de moyens de support reliés à la couche dissipatrice de l'électricité statique pour supporter de façon mobile la couche dissipatrice de l'électricité statique en une première et en une seconde position. Les moyens de support permettent à la couche dissipatrice de l'électricité statique d'établir un contact initial avec les bornes d'un composant à tester afin de décharger l'électricité statique, le cas échéant, qui s'est formée au niveau des bornes du composant, la couche dissipatrice de l'électricité statique étant supportée au niveau de la première position relative. Les moyens de support permettent également à la couche dissipatrice de l'électricité statique d'exposer les broches d'essai à travers les ouvertures pour établir un contact avec les bornes du composant une fois que la couche dissipatrice de l'électricité statique a établi un contact initial avec les bornes du composant au niveau de la première position relative.
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