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1. WO2007139643 - METHOD OF MAKING AN ENCAPSULATED PLASMA SENSITIVE DEVICE

Publication Number WO/2007/139643
Publication Date 06.12.2007
International Application No. PCT/US2007/010068
International Filing Date 24.04.2007
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
C23C 14/0694
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
0694Halides
H01L 51/5256
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5253Protective coatings
5256having repetitive multilayer structures
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • VITEX SYSTEMS, INC. [US]/[US] (AllExceptUS)
  • MORO, Lorenza [IT]/[US] (UsOnly)
  • CHU, Xi [US]/[US] (UsOnly)
  • ROSENBLUM, Martin, Philip [US]/[US] (UsOnly)
  • NELSON, Kenneth, Jeffrey [US]/[US] (UsOnly)
  • BURROWS, Paul, E. [GB]/[US] (UsOnly)
  • GROSS, Mark, E. [US]/[US] (UsOnly)
  • ZUMHOFF, Mac, R. [US]/[US] (UsOnly)
  • MARTIN, Peter, M. [US]/[US] (UsOnly)
  • BONHAM, Charles, C. [US]/[US] (UsOnly)
  • GRAFF, Gordon, L. [US]/[US] (UsOnly)
Inventors
  • MORO, Lorenza
  • CHU, Xi
  • ROSENBLUM, Martin, Philip
  • NELSON, Kenneth, Jeffrey
  • BURROWS, Paul, E.
  • GROSS, Mark, E.
  • ZUMHOFF, Mac, R.
  • MARTIN, Peter, M.
  • BONHAM, Charles, C.
  • GRAFF, Gordon, L.
Agents
  • PRIOR, Patricia, L.
Priority Data
11/439,47423.05.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF MAKING AN ENCAPSULATED PLASMA SENSITIVE DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF ENCAPSULÉ SENSIBLE AU PLASMA
Abstract
(EN)
A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.
(FR)
La présente invention concerne un procédé de fabrication d'un dispositif encapsulé sensible au plasma. Le procédé comprend: la mise à disposition d'un dispositif sensible au plasma adjacent à un substrat; le dépôt d'une couche de protection contre le plasma sur le dispositif sensible au plasma au moyen d'un traitement choisi parmi des traitements non basés sur du plasma, ou des traitements de pulvérisation cathodique modifiés; et le dépôt d'au moins un empilement de barrières comprenant au moins une couche de découplage et au moins une couche barrière, le dispositif sensible au plasma étant encapsulé entre le substrat et ledit empilement de barrières, ladite couche de découplage, ladite couche barrière, ou les deux étant déposés au moyen d'un traitement à base de plasma, le dispositif encapsulé sensible au plasma subissant une quantité réduite d'endommagement provoqué par le plasma comparé à un dispositif encapsulé sensible au plasma fabriqué sans une couche de protection contre le plasma. L'invention concerne également un dispositif encapsulé sensible au plasma.
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