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1. WO2007139560 - MODULAR COMPUTING ENVIRONMENTS

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

WHAT IS CLAIMED IS:

1. A computer system comprising:
a connecting hub having a plurality of docking regions and configured to provide to each docking region electrical power, a data network interface, a 5 cooling fluid supply and a cooling fluid return; and
a plurality of shipping containers, each shipping container enclosing a modular computing environment that adds a predetermined amount of computing power to the computer system, each shipping container having a) a plurality of processing units that are coupled to the data network interface; b) a o heat exchanger configured to remove heat generated by the plurality of processing units from the shipping container by circulating cooling fluid from the cooling fluid supply through the heat exchanger and discharging heated cooling fluid into the cooling fluid return; and c) docking members configured to releaseably connect to the connecting hub at one of the plurality of docking 5 regions to receive electrical power, connect to the data network interface, receive cooling fluid from the cooling fluid supply, and discharge return cooling fluid to the cooling fluid return.
2. The computer system of claim 1 , where each processing unit comprises at least one storage device.
0 3. The computer system of claim 1 , where the docking members comprise quick-connect docking members.
4. The computer system of claim 1, where the connecting hub comprises a spine.
5. The computer system of claim 1 , where the connecting hub 5 comprises a ring.
6. A modular data center comprising:
a connecting hub having a plurality of docking regions and configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and
0 a plurality of containers, each container enclosing a modular computing environment having a plurality of computing devices that collectively add a predetermined amount of computing power to the modular data center, each container having a) a first heat exchange circuit configured to transfer heat from the computing devices to a heat exchanger; b) a second heat exchange circuit comprising the heat exchanger, the cooling fluid supply and cooling fluid return, the second heat exchange circuit being configured to transfer heat from the heat exchanger inside of the container to a system outside of the container via cooling fluid in the cooling fluid supply and cooling fluid return; and c) docking members that releaseably connect to the connecting hub at one of the plurality of docking regions to receive electrical power, connect to the data network interface, receive cooling fluid from the cooling fluid supply, and discharge return cooling fluid to the cooling fluid return.
7. The modular data center of claim 6, where each modular computing environment comprises a) a plurality of microprocessor boards that receive power from the connecting hub and receive data from a network coupled to the data network interface, process the received data and transmit the processed data to the network via the data network interface; b) a ventilation system that draws air from a cold air plenum adjacent to the plurality of racks, across the plurality of microprocessor boards, and into a warm air plenum; where the heat exchanger cools air from the warm air plenum and discharges the cooled air into the cold air plenum.
8. The modular data center of claim 7, where the modular computing environment is configured to accommodate human occupancy.
9. The modular data center of claim 8, where the modular computing environment includes a fire and smoke detection system and a fire suppression system.
10. The modular data center of claim 6, where the ventilation system comprises a first set of fans and a second set of fans, each fan in the first set being disposed on one of the plurality of microprocessor boards, each fan in the second set being disposed adjacent to the heat exchanger.
11. The modular data center of claim 10, where adjacent fans in the second set are supplied by electrical power from different electrical circuits.
12. The modular data center of claim 10, further comprising a duct disposed between the heat exchanger and at least a first fan and a second fan in the second set, the duct fluidly coupling a region adjacent to the first fan and a region adjacent to the second fan.

13. The modular data center of claim 6, where the plurality of microprocessor boards are disposed in racks that are suspended from a ceiling of a corresponding container.
14. The modular data center of claim 6, where at least one of the plurality of containers is stacked on top of another one of the plurality of containers.
15. The modular data center of claim 6, further comprising a facility-level cooling system that is disposed in the second heat exchange circuit, coupled to the cooling fluid supply and cooling fluid return, and configured to remove heat from cooling fluid in the cooling fluid return.
16. The modular data center of claim 6, where each container is sealed against environmental elements of wind and moisture.
17. The modular data center of claim 6, further comprising a normally sealed drain configured to open when in contact with an appreciable amount of liquid.
18. The modular data center of claim 6, where at least two of the plurality of containers are standard size shipping containers.
19. The modular data center of claim 18, where the standard size is a IAAA shipping container.
20. A method of deploying a modular data center comprising:
providing a cooling system configured to provide cooling fluid to various cooling devices, receive return cooling fluid from the various cooling devices and remove heat from the received return cooling fluid;
providing an electrical power source;
providing a data communication interface;
routing electrical power from the electrical power source, a connection to the data communication interface, and a cooling fluid supply and cooling fluid return from the cooling system to a plurality of docking regions that each have stubs that are configured to couple the electrical power, cooling fluid supply, cooling fluid return and data communication interface connection to a modular computing environment;
disposing modular computing environments at at least two of the plurality of docking regions, each modular computing environment configured to incrementally add computing power to a data center and including a plurality of computing resources and integrated cooling devices; and
coupling each self contained computing environment at a corresponding docking region to the stubs to provide electrical power, cooling fluid supply and cooling fluid return, and connection to the data communication interface to the modular computing environment.
21. A method of processing data comprising:
transmitting a request for data to a system comprising a) a connecting hub having a plurality of docking regions and configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and b) a plurality of shipping containers, each shipping container enclosing a modular computing environment that adds a replacement amount of computing power to the computer system, each shipping container having 1) a plurality of processing units that are coupled to the data network interface; 2) a heat exchanger configured to remove heat generated by the plurality of processing units from the shipping container by circulating cooling fluid from the cooling fluid supply through the heat exchanger and discharging heated cooling fluid into the cooling fluid return; and 3) docking members configured to releaseably connect to the connecting hub at one of the plurality of docking regions to receive electrical power, connect to the data network interface, receive cooling fluid from the cooling fluid supply, and discharge return cooling fluid to the cooling fluid return; and
receiving data in response to the request.