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1. WO2007116345 - INTER-LAYER CONNECTION FOR FOIL MEMS TECHNOLOGY

Publication Number WO/2007/116345
Publication Date 18.10.2007
International Application No. PCT/IB2007/051197
International Filing Date 04.04.2007
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2207/07
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
07Interconnects
B81B 7/0006
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0006Interconnects
H01L 21/4857
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4857Multilayer substrates
H01L 23/49822
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49822Multilayer substrates
H01L 23/4985
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
4985Flexible insulating substrates
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • NXP B.V. [NL]/[NL] (AllExceptUS)
  • LANGEREIS, Geert [NL]/[NL] (UsOnly)
  • BOEREFIJN, Ivar, J. [NL]/[NL] (UsOnly)
Inventors
  • LANGEREIS, Geert
  • BOEREFIJN, Ivar, J.
Agents
  • VAN DER VEER, Johannis, L.
Priority Data
06112417.810.04.2006EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTER-LAYER CONNECTION FOR FOIL MEMS TECHNOLOGY
(FR) CONNEXION INTER-COUCHES POUR TECHNOLOGIE DES MEMS À COUCHES MINCES
Abstract
(EN)
The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (10). Conductive inter-layer connections (210, 300, 400) made of solder material, sputtered or evaporated material or by means of carbonization of plastic material building the isolating layer (30) of the flexible foils (10) are formed to connect patterned conductive layers (40, 50) separated by means of at least one isolating layer (30) in a conductive way in order to interconnect different parts of the microsystem in an easy way.
(FR)
La présente invention concerne un procédé pour réaliser des connexions conductrices inter-couches dans un micro-système élaboré à partir d'un empilement de couches minces flexibles (10) formant des motifs. Des connexions conductrices inter-couches (210, 300, 400) faites de matière de soudure, de matière pulvérisée ou évaporée ou par carbonisation de matière plastique constituant la couche isolante (30) des couches minces flexibles (10), sont formées pour connecter des couches conductrices à motif (40, 50) séparées par au moins une couche isolante (30) d'une manière conductrice afin d'interconnecter différentes parties du micro-système d'une manière simple.
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