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1. (WO2007111348) SUBSTRATE TREATING APPARATUS

Pub. No.:    WO/2007/111348    International Application No.:    PCT/JP2007/056609
Publication Date: Fri Oct 05 01:59:59 CEST 2007 International Filing Date: Thu Mar 29 01:59:59 CEST 2007
IPC: H01L 21/318
H01L 21/31
Applicants: HITACHI KOKUSAI ELECTRIC INC.
株式会社日立国際電気
OKUDA, Kazuyuki
奥田 和幸
MIZUNO, Norikazu
水野 謙和
Inventors: OKUDA, Kazuyuki
奥田 和幸
MIZUNO, Norikazu
水野 謙和
Title: SUBSTRATE TREATING APPARATUS
Abstract:
A substrate treating apparatus comprising a treating space being a space for substrate treatment; a heating member for heating the treating space; a gas supply member for feeding at least first and second treating gases to the treating space; an evacuation member for evacuating the atmosphere from the treating space; and a control member for controlling at least the gas supply member and the evacuation member, which control member in the forming of a desired film on the substrate controls so as to realize multiple alternate repetitions of supply and evacuation of the treating gases while avoiding mixing of the first and second treating gases in the treating space and in the coating of the inner wall surface of the treating space with a desired film controls so as to simultaneously supply the first and second treating gases to the treating space.