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1. (WO2007107601) CARRIER BODY FOR COMPONENTS OR CIRCUITS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/107601 International Application No.: PCT/EP2007/052726
Publication Date: 27.09.2007 International Filing Date: 22.03.2007
Chapter 2 Demand Filed: 12.10.2007
IPC:
H01L 23/373 (2006.01) ,H01L 23/367 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
Applicants:
CERAMTEC AG [DE/DE]; Fabrikstrasse 23 - 29 73207 Plochingen, DE (AllExceptUS)
KLUGE, Claus, Peter [DE/DE]; DE (UsOnly)
Inventors:
KLUGE, Claus, Peter; DE
Agent:
SCHERZBERG, Andreas; Patente, Marken & Lizenzen c/o Chemetall GmbH Trakehner Str. 3 60487 Frankfurt, DE
Priority Data:
10 2006 013 873.223.03.2006DE
10 2006 055 965.724.11.2006DE
10 2006 058 417.108.12.2006DE
Title (DE) TRÄGERKÖRPER FÜR BAUELEMENTE ODER SCHALTUNGEN
(EN) CARRIER BODY FOR COMPONENTS OR CIRCUITS
(FR) ÉLÉMENT SUPPORT POUR COMPOSANTS OU CIRCUITS
Abstract:
(DE) Die Erfindung betrifft einen Trägerkörper (1, 2) für elektrische oder elektronische Bauelemente (6a, 6b, 6c, 6d) oder Schaltungen, wobei der Trägerkörper (1, 2) elektrisch nicht oder nahezu nicht leitend ist. Zur Vereinfachung des Trägerkörpers (1) bei gleichzeitiger extrem verbesserter Wärmeableitung wird erfindungsgemäß vorgeschlagen, dass der Trägerkörper (1, 2) einstückig mit Wärme ab- oder zuführenden Kühlelementen (7) versehen ist.
(EN) The invention relates to a carrier body (1, 2) for electrical or electronic components (6a, 6b, 6c, 6d) or circuits, the carrier body (1, 2) being non-electroconductive or almost non-electroconductive. The aim of the invention is to simplify said carrier body (1) while significantly improving the heat dissipation. To this end, the carrier body (1, 2) is provided as a single component with heat removing or heat supplying cooling elements (7).
(FR) L'invention concerne un élément support (1,2) pour des composants ou des circuits électriques ou électroniques (6a, 6b, 6c, 6d), l'élément support (1,2) n'étant pas ou presque pas électriquement conducteur. L'invention vise à simplifier cet élément support (1) tout en améliorant considérablement la dissipation de chaleur. A cet effet, l'élément support (1,2) est doté d'éléments thermiques (7) qui apportent ou évacuent la chaleur et forment un seul bloc avec ledit élément support.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
NO20084351MXMX/a/2008/012029KR1020090005047IL194282SG146170EP2002476
EP2320457ZA2008/08288JP2009531844EP2387068EP2387069EP2387071
EP2387072EP2387073EP2387074EP2388811EP2397754EP2398050
US20090086436RU0002434313CA2644433AU2007228752ID049.2038MYPI 20083721
IN5706/CHENP/2008