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1. WO2007105158 - METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE

Publication Number WO/2007/105158
Publication Date 20.09.2007
International Application No. PCT/IB2007/050790
International Filing Date 09.03.2007
IPC
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
CPC
B81B 7/007
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
007Interconnections between the MEMS and external electrical signals
B81C 1/00238
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00222Integrating an electronic processing unit with a micromechanical structure
00238Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 23/5387
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5387Flexible insulating substrates
H01L 2924/1461
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
146Mixed devices
1461MEMS
Applicants
  • NXP B.V. [NL]/[NL] (AE, AG, AL, AM, AT, AU, AZ, BA, BB, BE, BF, BG, BJ, BR, BW, BY, BZ, CA, CF, CG, CH, CI, CM, CN, CO, CR, CU, CY, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IE, IL, IN, IS, IT, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, MG, MK, ML, MN, MR, MT, MW, MX, MY, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SI, SK, SL, SM, SN, SV, SY, SZ, TD, TG, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW)
  • LANGEREIS, Geert [NL]/[NL] (UsOnly)
  • BOEREFIJN, Ivar, J. [NL]/[NL] (UsOnly)
Inventors
  • LANGEREIS, Geert
  • BOEREFIJN, Ivar, J.
Agents
  • WHITE, Andrew, G.
Priority Data
06111124.114.03.2006EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE
(FR) PROCEDE DE FABRICATION D'UN BOITIER MICROELECTRONIQUE
Abstract
(EN)
The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured using a flexible foil (80) having conductive tracks (100) on at least on side of the flexible foil. The electronic microsystem (200) and the flexible foil (80) are arranged in a way that a sealed or even hermetic package can be realized and contact pads (210) of the electronic microsystem (200) are connected to conductive tracks (100) extending to the outer surface of the packaged device after folding the flexible foil (80) in the proposed way. No vias or throughholes in the flexible foil (80) are needed.
(FR)
L'invention concerne un procédé de mise sous boîtier d'un microsystème électronique (200) ainsi qu'un dispositif sous boîtier ainsi obtenu. Le procédé de l'invention permet de fabriquer un microsystème électronique (200) sous boîtier à l'aide d'une feuille souple (80) dont un côté au moins comporte des rubans conducteurs (100). Le microsystème électronique (200) et la feuille souple (80) sont conçus de manière à former un boîtier étanche ou hermétique et des pastilles de contact (210) du microsystème électronique (200) sont connectées aux rubans conducteurs (100) qui s'étendent jusqu'à la surface extérieure du dispositif sous boîtier une fois la feuille souple (80) repliée de la manière suggérée. La feuille souple ne nécessite aucune traversée ni trou traversant.
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