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1. WO2007098402 - CUSTOMIZABLE POWER AND GROUND PINS

Publication Number WO/2007/098402
Publication Date 30.08.2007
International Application No. PCT/US2007/062308
International Filing Date 16.02.2007
IPC
H01L 23/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/49109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
49105Connecting at different heights
49109outside the semiconductor or solid-state body
H01L 2224/49113
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4911the connectors being bonded to at least one common bonding area, e.g. daisy chain
49113the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
H01L 23/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
50for integrated circuit devices, ; e.g. power bus, number of leads
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
H01L 24/49
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
Applicants
  • EASIC CORPORATION [US]/[US] (AllExceptUS)
  • MIHELCIC, Stan, J. [US]/[US] (UsOnly)
  • LEVINTHAL, Adam [US]/[US] (UsOnly)
  • COOKE, Laurence, H. [US]/[US] (UsOnly)
Inventors
  • MIHELCIC, Stan, J.
  • LEVINTHAL, Adam
  • COOKE, Laurence, H.
Agents
  • GLUCK, Jeffrey, W.
Priority Data
11/354,95716.02.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CUSTOMIZABLE POWER AND GROUND PINS
(FR) BROCHES D'ALIMENTATION ÉLECTRIQUE ET DE MISE À LA TERRE PERSONNALISABLES
Abstract
(EN)
A configurable logic array composed of: a multiplicity of logic cells, each containing look-up tables, a multiplicity of customizable I/O cells, each containing a multiplicity of pads; and a customizable via connection layer for customizing the cells and interconnect between them, may be constructed to include the option of customizing the I/O cells to act as power or ground pins. Assigning custom power and ground pins may depend on the types of I/O cells and package bonding options.
(FR)
La matrice logique configurable selon l'invention est composée : d'une multiplicité de cellules logiques, contenant chacune des tables de conversion, d'une multiplicité de cellules d'E/S personnalisables, contenant chacune une multiplicité de pastilles de connexion ; et d'une couche d'interconnexion servant à personnaliser les cellules et à les interconnecter. Ladite matrice peut être fabriquée de façon à prévoir l'option de personnalisation des cellules d'E/S pour qu'elles servent au choix de broches d'alimentation ou de mise à la terre. La désignation personnalisée comme broches d'alimentation ou de mise à la terre peut dépendre du type de cellules d'E/S et des options de connexion du boîtier.
Also published as
Latest bibliographic data on file with the International Bureau