Processing

Please wait...

Settings

Settings

Goto Application

1. WO2007098153 - METHOD AND APPARATUS FOR STRAIN MONITORING OF PRINTED CIRCUIT BOARD ASSEMBLIES

Publication Number WO/2007/098153
Publication Date 30.08.2007
International Application No. PCT/US2007/004357
International Filing Date 20.02.2007
IPC
G01L 1/22 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
1Measuring force or stress, in general
20by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
22using resistance strain gauges
CPC
G01R 31/2817
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
2817Environmental-, stress-, or burn-in tests
H05K 1/0268
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0266Marks, test patterns or identification means
0268for electrical inspection or testing
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 2201/10151
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10151Sensor
H05K 2203/163
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
16Inspection; Monitoring; Aligning
163Monitoring a manufacturing process
Applicants
  • CISCO TECHNOLOGY, INC. [US]/[US] (AllExceptUS)
  • AHMAD, Mudasir [PK]/[US] (UsOnly)
  • TENG, Sue [US]/[US] (UsOnly)
Inventors
  • AHMAD, Mudasir
  • TENG, Sue
Agents
  • HUANG, David, E.
Priority Data
11/358,27121.02.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR STRAIN MONITORING OF PRINTED CIRCUIT BOARD ASSEMBLIES
(FR) procédé et appareil de surveillance des contraintes d'ensembles cartes A CIRCUIT imprimé
Abstract
(EN)
A technique of monitoring strain on a printed circuit board assembly involves the use of a strain detector (20) mounted on a printed circuit board (24). The strain detector is formed of a non-ductile material. The strain detector has a narrowed portion (70) forming a weak link that has a characteristic of breaking when a critical strain limit is exceeded. The method of monitoring can include visual or electrical inspection. The electrical inspection can include having a strain monitoring device (92). The strain monitoring device has a timer (94) connected to at least one strain detector and a memory (96) for storing results connected to the timer. The capacitance of at least one of the strain detectors is sampled and any change in capacitance is recorded to the memory. In one embodiment, a time stamp occurs in the memory based on when an electrical property changes across at least one of the strain detectors.
(FR)
L'invention concerne une technique de surveillance des contraintes sur un ensemble carte à circuit imprimé impliquant l'utilisation d'un détecteur de contrainte monté sur une carte à circuit imprimé. Le détecteur de contrainte est constitué d'un matériau non ductile. Le détecteur de contrainte possède une partie rétrécie constituant un maillon faible qui va rompre en cas de dépassement d'une limite de contrainte critique. Le procédé de surveillance peut comprendre une inspection visuelle ou électrique. L'inspection électrique peut faire appel à un dispositif de surveillance des contraintes. Le dispositif de surveillance des contraintes possède une minuterie connectée à au moins un détecteur de contrainte et une mémoire permettant de stocker les résultats connectée à la minuterie. La capacitance d'au moins l'un des détecteurs de contrainte est échantillonnée et tout changement de capacitance est enregistré dans la mémoire. Selon un mode de réalisation, un tampon horaire est imprimé dans la mémoire selon le moment auquel une propriété électrique change en traversant au moins l'un des détecteurs de contrainte.
Also published as
Latest bibliographic data on file with the International Bureau