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1. WO2007095439 - ELECTROCHEMICAL ETCHING OF CIRCUITRY FOR HIGH DENSITY INTERCONNECT ELECTRONIC MODULES

Publication Number WO/2007/095439
Publication Date 23.08.2007
International Application No. PCT/US2007/061738
International Filing Date 07.02.2007
IPC
H01L 21/302 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/461 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
34the devices having semiconductor bodies not provided for in groups H01L21/06, H01L21/16, and H01L21/18159
46Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/36-H01L21/428142
461to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
CPC
C25F 3/02
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
3Electrolytic etching or polishing
02Etching
H05K 2203/1476
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
14Related to the order of processing steps
1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
H05K 2203/1492
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
14Related to the order of processing steps
1492Periodical treatments, e.g. pulse plating of through-holes
H05K 3/06
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
061Etching masks
H05K 3/07
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
07being removed electrolytically
Applicants
  • FARADAY TECHNOLOGY, INC. [US]/[US] (AllExceptUS)
  • TAYLOR, Jennings, E. [US]/[US] (UsOnly)
  • SUN, Jenny, J. [US]/[US] (UsOnly)
  • MCCRABB, Heather [US]/[US] (UsOnly)
Inventors
  • TAYLOR, Jennings, E.
  • SUN, Jenny, J.
  • MCCRABB, Heather
Agents
  • LEVY, Mark, P.
Priority Data
11/354,37615.02.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTROCHEMICAL ETCHING OF CIRCUITRY FOR HIGH DENSITY INTERCONNECT ELECTRONIC MODULES
(FR) GRAVURE ÉLECTROCHIMIQUE DE CIRCUITS POUR MODULES ÉLECTRONIQUES D'INTERCONNEXION À HAUTE DENSITÉ
Abstract
(EN)
A method for electrochemically etching a metal layer deposited on a dielectric with an etch resist layer pattern to form circuitry for high density interconnect electronic modules using a nonactive electrolyte solution is described. The method is particularly useful for printed wiring boards, chip scale packages, wafer level packages and the like. The circuit tracks generally range from 50 to 125 micrometers for printed wiring boards, from 5 to 50 micrometers for chip scale packages, and from 0.1 to 5 micrometers for wafer level packages, hi one embodiment of the invention the metal layer is copper and the nonactive electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
(FR)
La présente invention concerne un procédé de gravure électrochimique d'une couche métallique déposée sur un diélectrique avec un motif de couche d'enduit protecteur de gravure pour tracer des circuits pour des modules électroniques d'interconnexion à haute densité au moyen d'une solution électrolytique non active. Le procédé est particulièrement utile pour les cartes à circuit imprimé, les boîtiers-puces, l'encapsulation sur tranches et similaire. La taille des pistes de circuit est généralement comprise entre 50 et 125 micromètres pour les cartes de circuit imprimé, entre 5 et 50 micromètres pour les boîtiers-puces, et entre 0,1 et 5 micromètres pour l'encapsulation sur tranches. Dans un mode de réalisation selon l'invention la couche métallique est du cuivre et la solution électrolytique non active est un mélange de nitrate de sodium et de chlorure de sodium et un courant électrique à impulsions est utilisé pour réaliser la gravure électrochimique.
Also published as
Latest bibliographic data on file with the International Bureau