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1. (WO2007095241) HIGH ASPECT RATIO MICROSTRUCTURES AND METHOD FOR FABRICATING HIGH ASPECT RATIO MICROSTRUCTURES FROM POWDER COMPOSITES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/095241    International Application No.:    PCT/US2007/003821
Publication Date: 23.08.2007 International Filing Date: 12.02.2007
IPC:
B22F 1/00 (2006.01)
Applicants: CREATV MICROTECH, INC. [US/US]; 11609 Potomac Drive, Potomac, MD 20854 (US) (For All Designated States Except US).
AMSTUTZ, Platte [US/US]; (US) (For US Only).
MAKAROVA, Olga [RU/US]; (US) (For US Only).
YANG, Guohua [CN/US]; (US) (For US Only)
Inventors: AMSTUTZ, Platte; (US).
MAKAROVA, Olga; (US).
YANG, Guohua; (US)
Agent: TORGOVITSKY, Stanislav; Roylance, Abrams, Berdo & Goodman, L.l.p., 1300 19th Street, N.w., Suite 600, Washington, DC 20036 (US)
Priority Data:
60/772,583 13.02.2006 US
Title (EN) HIGH ASPECT RATIO MICROSTRUCTURES AND METHOD FOR FABRICATING HIGH ASPECT RATIO MICROSTRUCTURES FROM POWDER COMPOSITES
(FR) MICROSTRUCTURES AYANT UN RAPPORT LONGUEUR/DIAMETRE ELEVE ET PROCEDE DE FABRICATION DE MICROSTRUCTURES AYANT UN RAPPORT LONGUEUR/DIAMETRE ELEVE A PARTIR DE COMPOSITES EN POUDRE
Abstract: front page image
(EN)Methods to fabricate high aspect ratio powder composite microstructures is provided by filling a molding composition containing a powdered material and a binder into a patterned mold, and releasing the cured composite microstructures from the mold. An alternate method is by filling a mix of powdered dense metals and low-melt alloys into a patterned mold, and releasing the melted and solidified composite microstructures from the mold. The mold is derived from lithographically defined parent mold. One example of the application is in the field of x-ray anti-scatter grids and nuclear collimators.
(FR)L'invention concerne des procédés de fabrication de microstructures de composite en poudre ayant un rapport longueur/diamètre élevé, consistant à introduire une composition de moulage contenant un matériau pulvérulent et un liant dans un moule à motif et à libérer du moule les microstructures composites durcies. Un autre procédé consiste à introduire un mélange de métaux denses pulvérulents et d'alliages de faible point de fusion dans un moule à motif et à libérer du moule les microstructures composites fondues et solidifiées. Le moule dérive d'un moule parent défini par lithographie. Un exemple d'application peut être dans le domaine des grilles anti-dipersions pour rayons X et des collimateurs nucléaires.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)