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Machine translation
1. (WO2007093710) METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FIXATION OF THE COMPONENTS, AND CORRESPONDING PRODUCTION LINE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/093710    International Application No.:    PCT/FR2007/000271
Publication Date: 23.08.2007 International Filing Date: 15.02.2007
IPC:
H05K 3/34 (2006.01), H05K 3/36 (2006.01)
Applicants: VALEO SYSTEMES DE CONTROLE MOTEUR [FR/FR]; 14 avenue des Béguines, F-95800 Cergy (FR) (For All Designated States Except US).
LEFEVRE, Bruno [FR/FR]; (FR) (For US Only).
MORENO, Jean-Yves [FR/FR]; (FR) (For US Only).
SCHWARTZ, Christian [FR/FR]; (FR) (For US Only)
Inventors: LEFEVRE, Bruno; (FR).
MORENO, Jean-Yves; (FR).
SCHWARTZ, Christian; (FR)
Agent: LAVIALLE, Bruno; c/o CABINET BOETTCHER, 22 rue du Général Foy, F-75008 Paris (FR)
Priority Data:
0601356 16.02.2006 FR
Title (EN) METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FIXATION OF THE COMPONENTS, AND CORRESPONDING PRODUCTION LINE
(FR) PROCEDE DE FABRICATION D'UN MODULE ELECTRONIQUE PAR FIXATION SEQUENTIELLE DES COMPOSANTS ET LIGNE DE PRODUCTION CORRESPONDANTE
Abstract: front page image
(EN)The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder (8) is placed on the board; the first type of component is placed in position; the board is generally heated in order to melt the solder in such a way as to solder the first type of component; the second type of component is positioned in such a way that it has tongues (7) which are supported on the board by means of solder; and the solder is locally heated such that it melts in order to solder the second type of component. The invention also relates to a production line for implementing said method.
(FR)L'invention concerne un procédé de fabrication d'un module électronique (2) comportant une carte (3) à circuit imprimé (4), au moins un composant d'un premier type (5) et un composant d'un deuxième type (6), le procédé comprenant les étapes de : - disposer de la brasure (8) sur la carte, - positionner le composant du premier type, - chauffer globalement la carte pour fondre la brasure de manière à souder le composant du premier type, - positionner le composant du deuxième type de telle manière que celui-ci ait des pattes (7) en appui sur la carte par de la brasure, - chauffer localement la brasure pour fondre la brasure de manière à souder le composant du deuxième type. L'invention a également pour objet une ligne de production pour la mise en oeuvre de ce procédé.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: French (FR)
Filing Language: French (FR)