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1. WO2007092442 - SYSTEM AND METHOD FOR PRODUCING AND DELIVERING VAPOR

Publication Number WO/2007/092442
Publication Date 16.08.2007
International Application No. PCT/US2007/003143
International Filing Date 07.02.2007
Chapter 2 Demand Filed 07.12.2007
IPC
C23C 16/00 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
H01L 21/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
H01L 21/205 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
205using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
CPC
F22B 35/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
22STEAM GENERATION
BMETHODS OF STEAM GENERATION; STEAM BOILERS
35Control systems for steam boilers
F22B 35/005
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
22STEAM GENERATION
BMETHODS OF STEAM GENERATION; STEAM BOILERS
35Control systems for steam boilers
005Control systems for instantaneous steam boilers
Applicants
  • CELERITY, INC. [US]/[US] (AllExceptUS)
  • BUCHANAN, Daryl [US]/[US] (UsOnly)
  • TARIQ, Faisal [PK]/[US] (UsOnly)
  • MEI, Hai [US]/[US] (UsOnly)
  • TISON, Stuart [US]/[US] (UsOnly)
Inventors
  • BUCHANAN, Daryl
  • TARIQ, Faisal
  • MEI, Hai
  • TISON, Stuart
Agents
  • SCHEINBERG, Michael, O.
Priority Data
11/349,06807.02.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SYSTEM AND METHOD FOR PRODUCING AND DELIVERING VAPOR
(FR) SYSTEME ET PROCEDE POUR PRODUIRE ET FOURNIR DE LA VAPEUR
Abstract
(EN)
Systems and methods for producing and delivering vapor are disclosed. A vaporizer tank containing a liquid may be heated such that liquid within the tank is heated and vapor generated. The flow of this vapor to a destination may then be regulated. Embodiments of the present invention may control the temperature of this liquid such that a saturated vapor condition is substantially maintained in the vaporizer tank. The vaporizer tank is coupled to a mass flow controller which regulates the delivery of the vapor to downstream components. By substantially maintaining the saturated vapor condition within the vaporizer tank the pressure of vapor at the mass flow controller can be substantially maintained and a stable and consistent flow rate of vapor achieved.
(FR)
L'invention concerne des systèmes et des procédés pour produire et fournir de la vapeur Un réservoir de vaporisation contenant un liquide peut être chauffé de sorte que le liquide contenu dans le réservoir soit chauffé et que de la vapeur soit générée. Il est alors possible de réguler le flux de cette vapeur vers une destination. Des modes de réalisation de la présente invention peuvent contrôler la température de ce liquide de sorte qu'une condition de vapeur saturée soit sensiblement maintenue dans le réservoir de vaporisation. Le réservoir de vaporisation est couplé à un régulateur de débit massique qui régule la livraison de la vapeur vers des composants en aval. En maintenant sensiblement la condition de vapeur saturée dans le réservoir de vaporisation, il est possible de maintenir sensiblement la pression de vapeur au niveau du régulateur de débit massique et d'obtenir une vitesse stable et constante d'écoulement de la vapeur.
Also published as
Latest bibliographic data on file with the International Bureau