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1. WO2007091329 - ELECTRONIC COMPONENT PACKAGE

Publication Number WO/2007/091329
Publication Date 16.08.2007
International Application No. PCT/JP2006/302356
International Filing Date 10.02.2006
IPC
H01L 23/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
06characterised by the material of the container or its electrical properties
08the material being an electrical insulator, e.g. glass
H01L 23/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
G02B 6/4201
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
H01L 2223/6627
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
6627Waveguides, e.g. microstrip line, strip line, coplanar line
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 2224/32188
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32153the body and the item being arranged next to each other, e.g. on a common substrate
32175the item being metallic
32188the layer connector connecting to a bonding area protruding from the surface of the item
H01L 23/057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
053the container being a hollow construction and having an insulating ; or insulated; base as a mounting for the semiconductor body
057the leads being parallel to the base
H01L 23/4985
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
4985Flexible insulating substrates
Applicants
  • 富士通株式会社 FUJITSU LIMITED [JP]/[JP] (AllExceptUS)
  • 八木澤 孝俊 YAGISAWA, Takatoshi [JP]/[JP] (UsOnly)
  • 池内 公 IKEUCHI, Tadashi [JP]/[JP] (UsOnly)
Inventors
  • 八木澤 孝俊 YAGISAWA, Takatoshi
  • 池内 公 IKEUCHI, Tadashi
Agents
  • 伊東 忠彦 ITOH, Tadahiko
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC COMPONENT PACKAGE
(FR) BOÎTIER DE COMPOSANT ÉLECTRONIQUE
(JA) 電子部品パッケージ
Abstract
(EN)
An electronic component package (10 (100)) comprises a film substrate (2 (102)) on which an electronic component (1) is mounted and a lid part (4 (104)) which is placed on the film substrate (2 (102)) so as to cover the film substrate (2 (102)). The electronic component (1) is characterized by being provided in a cavity (15 (130)) formed by the film substrate (2 (102)) and the lid part (4 (104)).
(FR)
L'invention concerne un boîtier de composant électronique (10 (100)) qui comprend un substrat en film (2 (102)) sur lequel est monté un composant électronique (1) et une pièce de couvercle (4 (104)) qui est placée sur le substrat en film (2 (102)) de façon à recouvrir le substrat en film (2 (102)). Le composant électronique (1) est caractérisé en ce qu'il est utilisé dans une cavité (15 (130)) formée par substrat en film (2 (102)) et par la pièce de couvercle (4 (104)).
(JA)
 電子部品パッケージ10(100)は、電子部品1が実装されるフィルム基板2(102)と、前記フィルム基板2(102)を覆うように前記フィルム基板2(102)に載置される蓋部4(104)と、を備え、前記電子部品1は、前記フィルム基板2(102)と前記蓋部4(104)とによって形成されるキャビティ15(130)内に設けられていることを特徴とする。
Also published as
US12222115
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