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1. WO2007088921 - PALLET FOR FIXING WORK AND LIQUID APPLYING APPARATUS PROVIDED WITH SAME

Publication Number WO/2007/088921
Publication Date 09.08.2007
International Application No. PCT/JP2007/051675
International Filing Date 01.02.2007
Chapter 2 Demand Filed 29.11.2007
IPC
B05C 13/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
13Means for manipulating or holding work, e.g. for separate articles
02for particular articles
B05C 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
H01L 21/673 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673using specially adapted carriers
CPC
B05B 13/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
13Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
H01L 21/6715
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
6715Apparatus for applying a liquid, a resin, an ink or the like
Applicants
  • 武蔵エンジニアリング株式会社 MUSASHI ENGINEERING, INC. [JP]/[JP] (AllExceptUS)
  • 生島 和正 IKUSHIMA, Kazumasa [JP]/[JP] (UsOnly)
Inventors
  • 生島 和正 IKUSHIMA, Kazumasa
Agents
  • 須藤 阿佐子 SUDO, Asako
Priority Data
2006-02529202.02.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PALLET FOR FIXING WORK AND LIQUID APPLYING APPARATUS PROVIDED WITH SAME
(FR) PALETTE DE FIXATION DE PIECES A TRAVAILLER ET APPAREIL APPLICATEUR DE LIQUIDE MUNI DE CELLE-CI
(JA) ワークを固定するパレットおよびそれを備える液体塗布装置
Abstract
(EN)
[PROBLEMS] To provide a pallet for surely holding a board-shaped work on a table and applying a liquid on a desired position on the upper surface of the work, and to provide an applying apparatus having such pallet. [MEANS FOR SOLVING PROBLEMS] A pallet is arranged on a table of a liquid applying apparatus, which applies a liquid by moving relatively to the table a nozzle for discharging the liquid, and the pallet fixes a board-shaped work. The pallet is composed of a base having a work area for arranging a plurality of works in parallel in a row direction and/or a column direction; and a holding plate, which has a window (69) opened at the center portion of the work arranged on the work area and holds the work from the both ends.
(FR)
L'invention concerne une palette permettant de fixer en toute sécurité une pièce à travailler en forme de planche sur une table et d'appliquer un liquide à un emplacement souhaité sur la surface supérieure de la pièce à travailler, et un appareil applicateur muni d'une telle palette. La palette est arrangée sur une table d'un appareil applicateur de liquide, qui applique un liquide en déplaçant par rapport à la table une buse déchargeant le liquide, et la palette fixe une pièce à travailler en forme de planche. La palette est composée d'une base ayant une surface de travail pour arranger une pluralité de pièces à travailler parallèlement en rangée et/ou en colonne ; et une plaque de fixation, qui a une fenêtre (69) ouverte au niveau de la partie centrale de la pièce à travailler arrangée sur la surface de travail et qui maintient la pièce à travailler au niveau des deux extrémités.
(JA)
【課題】確実に板状のワークをテーブルに保持し、ワーク上面の所望位置に液体を塗布することを可能とするパレットおよびそれを備えた塗布装置の提供。 【解決手段】液体を吐出するノズルとテーブルとを相対的に移動して、液体を塗布する液体塗布装置のテーブル上に配置され、板状のワークを固定するためのパレットであって、前記パレットは、複数のワークを行方向および/または列方向に並列に配置するワークエリアを有するベースと、ワークエリアに配置されたワークの中央部を開放する窓(69)を有し、該ワークの両端部を挟着する押え板とから構成されることを特徴とするパレット。
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