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Pub. No.:    WO/2007/088755    International Application No.:    PCT/JP2007/051034
Publication Date: 09.08.2007 International Filing Date: 24.01.2007
H01L 21/306 (2006.01)
Applicants: SUMCO CORPORATION [JP/JP]; 2-1, Shibaura 1-chome, Minato-ku Tokyo1058634 (JP) (For All Designated States Except US).
KOYATA, Sakae [JP/JP]; (JP) (For US Only).
HASHII, Tomohiro [JP/JP]; (JP) (For US Only).
MURAYAMA, Katsuhiko [JP/JP]; (JP) (For US Only).
TAKAISHI, Kazushige [JP/JP]; (JP) (For US Only).
KATOH, Takeo [JP/JP]; (JP) (For US Only)
Inventors: KOYATA, Sakae; (JP).
HASHII, Tomohiro; (JP).
MURAYAMA, Katsuhiko; (JP).
TAKAISHI, Kazushige; (JP).
KATOH, Takeo; (JP)
Agent: SUDA, Masayoshi; OAK Ikebukuro Bldg., 21-11, Higashi-Ikebukuro 1-chome Toshima-ku, Tokyo1700013 (JP)
Priority Data:
2006-021900 31.01.2006 JP
(JA) ウェーハの枚葉式エッチング方法
Abstract: front page image
(EN)A method for etching the surface of a wafer while rotating a single thin disc silicon wafer fabricated by slicing a silicon single crystal ingot and supplying an etching liquid onto the top surface of the wafer. Etching liquid supply nozzles are so arranged as to be opposed to each other in the wafer radial directions indifferent positions. From the nozzles etching liquids different in one or two kinds selected from a group including the temperature, type, and supply flow are supplied onto the top surface of the wafer. The planarity of the wafer can be efficiently heightened, and the productivity is enhanced.
(FR)L'invention concerne un procédé de gravure de la surface d'une plaquette par rotation d'une plaquette de silicium en disque mince simple fabriquée par découpage en tranches d'un lingot de silicium monocristallin et fourniture d'un liquide de gravure sur la surface supérieure de la plaquette. Les buses de fourniture du liquide de gravure sont disposées opposées les unes aux autres dans les directions radiales de la plaquette de manière indifférente des positions. A partir des buses, les liquides de gravure différents dans un ou deux types choisis dans un groupe comportant la température, le type et le flux d'alimentation sont fournis sur la surface supérieure de la plaquette. La planarité de la plaquette peut être efficacement améliorée, et la productivité renforcée.
(JA)not available
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)