Processing

Please wait...

Settings

Settings

Goto Application

1. WO2007088647 - METHOD OF MOUNTING ELECTRIC PART

Publication Number WO/2007/088647
Publication Date 09.08.2007
International Application No. PCT/JP2006/314642
International Filing Date 25.07.2006
Chapter 2 Demand Filed 30.11.2007
IPC
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
G02F 1/1345 2006.01
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
13based on liquid crystals, e.g. single liquid crystal display cells
133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
1333Constructional arrangements
1345Conductors connecting electrodes to cell terminals
CPC
B30B 15/065
BPERFORMING OPERATIONS; TRANSPORTING
30PRESSES
BPRESSES IN GENERAL
15Details of, or accessories for, presses; Auxiliary measures in connection with pressing
06Platens or press rams
065Press rams
B30B 5/02
BPERFORMING OPERATIONS; TRANSPORTING
30PRESSES
BPRESSES IN GENERAL
5Presses characterised by the use of pressing means other than those mentioned in the preceding groups
02wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
H01L 2224/75315
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
75Apparatus for connecting with bump connectors or layer connectors
7525Means for applying energy, e.g. heating means
753by means of pressure
75301Bonding head
75314Auxiliary members on the pressing surface
75315Elastomer inlay
H01L 2224/75316
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
75Apparatus for connecting with bump connectors or layer connectors
7525Means for applying energy, e.g. heating means
753by means of pressure
75301Bonding head
75314Auxiliary members on the pressing surface
75315Elastomer inlay
75316with retaining mechanisms
H01L 2224/7598
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
75Apparatus for connecting with bump connectors or layer connectors
7598specially adapted for batch processes
H01L 2224/83192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83192wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Applicants
  • ソニーケミカル&インフォメーションデバイス株式会社 SONY CHEMICAL & INFORMATION DEVICE CORPORATION [JP]/[JP] (AllExceptUS)
  • ▲まつ▼村 孝 MATSUMURA, Takashi [JP]/[JP] (UsOnly)
  • 安藤 尚 ANDO, Hisashi [JP]/[JP] (UsOnly)
  • 蟹澤 士行 KANISAWA, Shiyuki [JP]/[JP] (UsOnly)
  • 須賀 保博 SUGA, Yasuhiro [JP]/[JP] (UsOnly)
  • 鈴木 和明 SUZUKI, Kazuaki [JP]/[JP] (UsOnly)
Inventors
  • ▲まつ▼村 孝 MATSUMURA, Takashi
  • 安藤 尚 ANDO, Hisashi
  • 蟹澤 士行 KANISAWA, Shiyuki
  • 須賀 保博 SUGA, Yasuhiro
  • 鈴木 和明 SUZUKI, Kazuaki
Agents
  • 阿部 英樹 ABE, Hideki
Priority Data
2006-02458601.02.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD OF MOUNTING ELECTRIC PART
(FR) PROCEDE DE MONTAGE D'UN COMPOSANT ELECTRIQUE
(JA) 電気部品の実装方法
Abstract
(EN)
A method of mounting in which electric parts of different mounting systems can be efficiently mounted with an adhesive. There is provided a method of mounting an electric part on glass substrate (1) with the use of thermocompression bonding head (7) including head main body (8) and, disposed thereon, compression bonding member (9) of given elastomer. This method comprises the step of arranging anisotropic conductive adhesive film (4) on the entire surface of mounting region (3) of the upper surface of glass substrate (1), thereafter superimposing electric parts of different mounting systems on the mounting region (3) and carrying out collective thermocompression bonding of the electric parts by the use of compression bonding member (9) with a size corresponding to that of the anisotropic conductive adhesive film (4). COG system IC chip (5) and FOG system flexible printed wiring board (6) can be appropriately used as the electric parts.
(FR)
L'invention concerne un procédé de montage dans lequel des composants électriques de différents systèmes de montage peuvent être montés efficacement avec un adhésif. On utilise un procédé de montage d'un composant électrique sur un substrat de verre (1) grâce à l'utilisation d'une tête de soudage (7) par thermocompression incluant un corps principal (8) de tête et, disposé sur celui-ci, un élément de soudage par compression (9) d'un élastomère donné. Ce procédé comprend les étapes consistant à agencer un film adhésif conducteur anisotrope (4) sur la surface complète de la zone de montage (3) de la surface supérieure du substrat de verre (1), ensuite superposer des composants électriques de différents systèmes de montage sur la zone de montage (3) et exécuter un soudage par thermocompression des composants électriques grâce à l'utilisation de l'élément de soudage par compression (9) présentant une taille correspondant à celle du film adhésif conducteur anisotrope (4). Une puce de circuit intégré de système COG (5) et une carte de câblage imprimé souple de système FOG (6) peuvent être utilisées de manière appropriée en tant que composants électriques.
(JA)
   本発明は、接着剤を用いて異なる実装方式の電気部品を効率良く実装することができる実装方法を提供する。本発明は、ヘッド本体8に所定のエラストマーからなる圧着部材9を有する熱圧着ヘッド7を用いてガラス基板1上に電気部品を実装する実装方法である。本発明においては、ガラス基板1上の実装領域3に異方導電性接着フィルム4を全面的に配置した後、異なる実装方式の電気部品をこの実装領域3に配置し、異方導電性接着フィルム4に対応する大きさの圧着部材9を用いて電気部品を一括して熱圧着する工程を有する。電気部品としては、COG方式のICチップ5、FOG方式のフレキシブルプリント配線板6を好適に用いることができる。
Latest bibliographic data on file with the International Bureau