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Machine translation
1. (WO2007087047) INTERCONNECT STRUCTURE FOR MEMS DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/087047    International Application No.:    PCT/US2006/048318
Publication Date: 02.08.2007 International Filing Date: 19.12.2006
Chapter 2 Demand Filed:    20.09.2007    
IPC:
G02B 26/00 (2006.01)
Applicants: QUALCOMM MEMS TECHNOLOGIES, INC. [US/US]; 5775 Morehouse Drive, San Diego, CA 92121 (US) (For All Designated States Except US).
LASITER, Jon, Bradley [US/US]; (US) (For US Only)
Inventors: LASITER, Jon, Bradley; (US)
Agent: ABUMERI, Mark, M.; KNOBBE MARTENS OLSON & BEAR LLP, 2040 Main Street, 14th Floor, Irvine, California 92614 (US)
Priority Data:
11/331,705 13.01.2006 US
Title (EN) INTERCONNECT STRUCTURE FOR MEMS DEVICE
(FR) STRUCTURE D'INTERCONNEXION POUR DISPOSITIF DE TYPE MEMS
Abstract: front page image
(EN)An iterferometric modulator array (800) is formed with connectors (840) and/or an encapsulation layer (802) with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.
(FR)L'invention concerne un réseau de modulateurs interférométriques qui est formé avec des connecteurs et/ou une couche d'enrobage comportant des connexions électriques. La couche d'enrobage rend hermétiquement étanche le réseau. Des circuits peuvent également être formés sur le réseau.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)