WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2007087021) WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE AND METHOD OF MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/087021    International Application No.:    PCT/US2006/047049
Publication Date: 02.08.2007 International Filing Date: 08.12.2006
IPC:
H01L 21/00 (2006.01)
Applicants: SITIME CORPORATION [US/US]; 990 Almanor Avenue, Suite 200, Sunnyvale, CA 94085 (US) (For All Designated States Except US).
PARTRIDGE, Aaron [US/US]; (US) (For US Only).
LUTZ, Markus [DE/US]; (US) (For US Only).
GUPTA, Pavan [US/US]; (US) (For US Only)
Inventors: PARTRIDGE, Aaron; (US).
LUTZ, Markus; (US).
GUPTA, Pavan; (US)
Agent: READ, Randol, W.; Patterson & Sheridan LLP, 3040 Post Oak Blvd., Suite 1500, Houston, TX 77056 (US)
Priority Data:
11/336,521 20.01.2006 US
Title (EN) WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE AND METHOD OF MANUFACTURING SAME
(FR) STRUCTURE MICRO ELECTROMECANIQUE ENCAPSULEE DANS UNE TRANCHE ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN)There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, • gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
(FR)Il existe de nombreuses inventions décrites et illustrées ici. Selon un aspect, les présentes inventions se rapportent à des dispositifs, des systèmes et/ou des procédés d'encapsulation et de fabrication de structures ou d'éléments électromécaniques, par exemple, un accéléromètre, • un gyroscope ou tout autre transducteur (par exemple, un capteur de pression, un capteur de contrainte, un capteur tactile, un capteur magnétique et/ou un capteur de température), un filtre ou un résonateur. La fabrication ou la production de systèmes micro électromécaniques de la présente invention et les systèmes fabriqués ainsi emploient des techniques d'encapsulation par liaison sur tranche.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)