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Machine translation
1. (WO2007086529) CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/086529    International Application No.:    PCT/JP2007/051315
Publication Date: 02.08.2007 International Filing Date: 22.01.2007
IPC:
H01L 21/304 (2006.01)
Applicants: JSR CORPORATION [JP/JP]; 6-10, Tsukiji 5-chome, Chuo-ku, Tokyo 1040045 (JP) (For All Designated States Except US).
HOSAKA, Yukio [JP/JP]; (JP) (For US Only).
TSUJI, Shoei [JP/JP]; (JP) (For US Only)
Inventors: HOSAKA, Yukio; (JP).
TSUJI, Shoei; (JP)
Agent: OHSHIMA, Masataka; OHSHIMA PATENT OFFICE BN Gyoen Building 17-11, Shinjuku 1-chome Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2006-015944 25.01.2006 JP
Title (EN) CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME
(FR) TAMPON DE POLISSAGE CHIMIQUE ET MÉCANIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 化学機械研磨パッドおよびその製造方法
Abstract: front page image
(EN)A chemical mechanical polishing pad is provided with a circular polishing surface and a non-polishing surface, i.e., the rear surface of the polishing surface, and includes inside an information recording medium from or in which information can be read or read/write without contact by using electromagnetic wave. Preferably, the position of the gravity center of the information recording medium in the radius direction of the polishing surface is within 0-10% or 80-100% of the radius of the polishing surface in a direction from the center on the radius of the polishing surface toward the outer circumference.
(FR)La présente invention concerne un tampon de polissage chimique et mécanique avec une surface de polissage circulaire et une surface de non polissage, c.-à-d. la surface arrière de la surface de polissage, ledit tampon comprenant à l'intérieur un support d'enregistrement d'informations à partir duquel ou dans lequel des informations peuvent être lues ou lues/écrites sans contact au moyen d'une onde électromagnétique. De préférence, la position du centre de gravité du support d'enregistrement d'informations dans la direction du rayon de la surface de polissage est située à 0-10% ou 80-100% du rayon de la surface de polissage dans une direction depuis le centre sur le rayon de la surface de polissage vers la circonférence externe.
(JA)本発明の化学機械研磨パッドは、円形の研磨面と該研磨面の裏面である非研磨面とを有し、内部に電磁波を用いて非接触に読み取りまたは読み書き可能な情報記録媒体を含んでなり、好ましくは研磨面の半径方向における情報記録媒体の重心の位置が、研磨面の半径上の中心から外周へと向かう方向で研磨面の半径の0~10%または80~100%の範囲内にある。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)