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1. WO2007086525 - SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE

Publication Number WO/2007/086525
Publication Date 02.08.2007
International Application No. PCT/JP2007/051307
International Filing Date 26.01.2007
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
H05K 1/141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
H05K 1/147
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
147at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
H05K 1/148
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
H05K 1/182
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
182associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
H05K 1/183
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
182associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
183Components mounted in and supported by recessed areas of the printed circuit board
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
Applicants
  • 松下電器産業株式会社 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • 早川 温雄 HAYAKAWA, Haruo (UsOnly)
  • 小西 一弘 KONISHI, Kazuhiro (UsOnly)
  • 吉田 守 YOSHIDA, Mamoru (UsOnly)
  • 河野 一則 KOUNO, Kazunori (UsOnly)
Inventors
  • 早川 温雄 HAYAKAWA, Haruo
  • 小西 一弘 KONISHI, Kazuhiro
  • 吉田 守 YOSHIDA, Mamoru
  • 河野 一則 KOUNO, Kazunori
Agents
  • 市川 利光 ICHIKAWA, Toshimitsu
Priority Data
2006-01784426.01.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE
(FR) STRUCTURE DE SUBSTRAT ET DISPOSITIF ELECTRONIQUE
(JA) 基板構造および電子機器
Abstract
(EN)
Provided is a substrate structure capable of reducing the size and thickness of a mobile terminal case. The substrate structure (10) includes a substrate (11), a plurality of electronic parts (12) mounted along one mounting surface (11A) of the substrate (11), and a resin portion (13) covering the electronic parts (12) with a resin (13A) and bonded to the mounting surface (11A) of the substrate (11). The substrate structure (10) has a through hole (14) penetrating the substrate (11) in the thickness direction. The mounting surface (11A) side of the through hole (14) is closed by a cover member (15). A rise portion (21) is arranged at the periphery of the cover member (15).
(FR)
L'invention concerne une structure de substrat permettant de limiter les dimensions et l'épaisseur d'un boîtier de terminal mobile. Cette structure (10) de substrat est composée d'un substrat (11), d'une pluralité de composants électroniques (12) montés le long d'une surface de montage (11A) du substrat (11) et d'une partie de résine (13) recouvrant les composants électroniques (12) par de la résine (13A) et adhérant à la surface de montage (11A) du substrat (11). Cette structure (10) comporte un perçage (14) pénétrant dans le substrat (11) dans le sens de l'épaisseur. Le côté surface de montage (11A) du perçage (14) est fermé par un élément couvrant (15). Une partie surélevée (21) est située sur la circonférence de l'élément couvrant (15).
(JA)
 携帯端末の筐体を小型化、薄型化できる基板構造を提供する。  基板構造10は、基板11と、基板11における一方の実装面11Aに沿って実装された複数の電子部品12と、各電子部品12を樹脂13Aにより被覆するとともに基板11の実装面11Aに密着する樹脂部13とを備える。基板構造10は、基板11を厚み方向に貫通する貫通孔14が設けられているとともに、貫通孔14における実装面11A側が蓋部材15により閉鎖されている。この蓋部材15の周部に立上部21が設けられている。
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