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1. (WO2007086183) HONEYCOMB STRUCTURE AND PROCESS FOR PRODUCING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/086183    International Application No.:    PCT/JP2006/323125
Publication Date: 02.08.2007 International Filing Date: 20.11.2006
IPC:
C04B 41/85 (2006.01), B01D 39/20 (2006.01), B01D 46/00 (2006.01), B01D 53/86 (2006.01), B01J 35/04 (2006.01), F01N 3/02 (2006.01)
Applicants: IBIDEN CO., LTD. [JP/JP]; 2-1, Kanda-cho, Ogaki-shi, Gifu 5038604 (JP) (For All Designated States Except US).
TAKAHASHI, Tomohisa [JP/JP]; (JP) (For US Only)
Inventors: TAKAHASHI, Tomohisa; (JP)
Agent: ONDA, Hironori; 12-1, Ohmiya-cho 2-chome Gifu-shi, Gifu 5008731 (JP)
Priority Data:
2006-019692 27.01.2006 JP
Title (EN) HONEYCOMB STRUCTURE AND PROCESS FOR PRODUCING THE SAME
(FR) STRUCTURE EN NID D'ABEILLES ET PROCESSUS POUR SA PRODUCTION
(JA) ハニカム構造体及びその製造方法
Abstract: front page image
(EN)Coating layer (34) is provided on all the circumferential surface of ceramic structure (23). The coating layer (34) not only prevents leaking out of exhaust gas from the circumferential region of the ceramic structure (23) but also inhibits displacement of honeycomb structure (21) within a casing. The main component of the coating layer (34) is a fused inorganic oxide.
(FR)L'invention concerne une couche (34) de revêtement mise en place sur toute la surface circonférentielle d'une structure (23) en céramique. La couche (34) de revêtement empêche non seulement les fuites de gaz d'échappement à partir de la région circonférentielle de la structure (23) en céramique, mais entrave également le déplacement de la structure (21) en nid d'abeilles à l'intérieur d'un boîtier. Le principal composant de la couche (34) de revêtement est un oxyde inorganique fondu.
(JA)セラミック構造体(23)の外周の全面に被覆層(34)が設けられている。被覆層(34)は、セラミック構造体(23)の外周部から排気ガスが漏れ出すことを防止することに加えて、ケーシング内におけるハニカム構造体(21)の位置ずれを抑制する。被覆層(34)の主成分は溶融無機酸化物である。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)