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Machine translation
1. (WO2007086064) DICED WAFER ADAPTOR AND A METHOD FOR TRANSFERRING A DICED WAFER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/086064    International Application No.:    PCT/IL2007/000102
Publication Date: 02.08.2007 International Filing Date: 25.01.2007
IPC:
G01R 31/02 (2006.01)
Applicants: VEKSTEIN, Uri [IL/IL]; (IL) (For US Only).
NISSANY, Itzik [IL/IL]; (IL) (For US Only).
CAMTEK LTD [IL/IL]; P.O. Box 544, 23150 Migdal-Haemek (IL) (For All Designated States Except US)
Inventors: VEKSTEIN, Uri; (IL).
NISSANY, Itzik; (IL)
Agent: RECHES, Oren; POB 913, 13 Hadafna St., 42823 Zoran (IL)
Priority Data:
60/762,530 27.01.2006 US
Title (EN) DICED WAFER ADAPTOR AND A METHOD FOR TRANSFERRING A DICED WAFER
(FR) ADAPTATEUR DE TRANCHE DECOUPÉE EN PUCES ET PROCÉDÉ DE TRANSFERT DE TRANCHE DÉCOUPÉE EN PUCES
Abstract: front page image
(EN)A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.
(FR)La présente invention concerne un adaptateur de tranche découpée en puces qui comprend : une partie interne de forme cylindrique, conçue pour supporter et maintenir un cadre annulaire et une membrane suspendue dans le cadre annulaire, et pour appliquer du vide sur un partie externe de la membrane. Une partie interne de la membrane supportant une tranche découpée en puces est entourée par la partie externe de la membrane. Enfin, une partie externe possède un périmètre formé sensiblement tel un périmètre de tranche non découpée en puces.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)