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1. (WO2007083963) CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2007/083963 International Application No.: PCT/KR2007/000355
Publication Date: 26.07.2007 International Filing Date: 22.01.2007
IPC:
H01B 5/14 (2006.01)
Applicants: HAN, Chul-Jong[KR/KR]; KR (UsOnly)
CHUNG, Yoon-Jae[KR/KR]; KR (UsOnly)
JANG, Jong-Yoon[KR/KR]; KR (UsOnly)
PARK, Jeong-Beom[KR/KR]; KR (UsOnly)
HAN, Yong-Seok[KR/KR]; KR (UsOnly)
CHOI, Sung-Uk[KR/KR]; KR (UsOnly)
CHO, Il-Rae[KR/KR]; KR (UsOnly)
MOON, Hyuk-Soo[KR/KR]; KR (UsOnly)
LEE, Kyung-Joon[KR/KR]; KR (UsOnly)
LS Cable Ltd.[KR/KR]; 19-20F ASEM Tower, 159, Samsung-dong, Gangnam-gu Seoul 135-090, KR (AllExceptUS)
Inventors: HAN, Chul-Jong; KR
CHUNG, Yoon-Jae; KR
JANG, Jong-Yoon; KR
PARK, Jeong-Beom; KR
HAN, Yong-Seok; KR
CHOI, Sung-Uk; KR
CHO, Il-Rae; KR
MOON, Hyuk-Soo; KR
LEE, Kyung-Joon; KR
Agent: KIM, Sang-Woo; 4F., Byukcheon Bldg., 1597-5 Seocho-dong, Seocho-gu Seoul, 137-876, KR
Priority Data:
10-2006-000634720.01.2006KR
Title (EN) CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME
(FR) STRUCTURE DE CONNEXION ET PROCÉDÉ D'ADHÉRENCE D'UNE CARTE PCB AU MOYEN D'UN FILM CONDUCTEUR ANISOTROPE, ET PROCÉDÉ D'ÉVALUATION D'UNE CONDITION DE CONNEXION ASSOCIÉ
Abstract: front page image
(EN) A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0D due to dents formed by heat-compression.
(FR) L'invention concerne une structure de connexion d'une carte PCB au moyen d'un film conducteur anisotrope, comprenant des éléments connectés les uns aux autres par compression thermique au moyen du film conducteur anisotrope comprenant un adhésif isolant comme matériau de base et des particules conductrices dispersées dans l'adhésif isolant, un des éléments au moins étant flexible, la valeur de rugosité de surface (Ra) de l'élément flexible variant de 0,1 à 5,0 D en raison de renfoncements formés par compression thermique.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: Korean (KO)