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Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2007/081504 International Application No.: PCT/US2006/048420
Publication Date: 19.07.2007 International Filing Date: 19.12.2006
IPC:
H04R 19/00 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19
Electrostatic transducers
Applicants: WEIGOLD, Jason, W.[US/US]; US (UsOnly)
MARTIN, John, R.[US/US]; US (UsOnly)
BROSNIHAN, Timothy, J.[US/US]; US (UsOnly)
ANALOG DEVICES, INC.[US/US]; One Technology Way Norwood, MA 02062-9106, US (AllExceptUS)
Inventors: WEIGOLD, Jason, W.; US
MARTIN, John, R.; US
BROSNIHAN, Timothy, J.; US
Agent: SUNSTEIN, Bruce, D. ; Bromberg & Sunstein LLP 125 Summer Street Boston, MA 02110-1618, US
Priority Data:
11/535,80427.09.2006US
60/757,70309.01.2006US
Title (EN) INTEGRATED MICROPHONE
(FR) MICROPHONE INTEGRE
Abstract:
(EN) A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.
(FR) L'invention concerne un procédé de fabrication d'un microphone présentant une capacité variable qui consiste tout d'abord à déposer un matériau de dépôt de haute température sur une puce ; le matériau de haute température formant par la suite une structure qui contribue à la capacité variable ; puis à former des circuits sur la puce après application du matériau de dépôt. Les circuits sont configurés pour détecter la capacité variable.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)