WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2007078893) EMBEDDED WAVEGUIDE PRINTED CIRCUIT BOARD STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/078893    International Application No.:    PCT/US2006/048090
Publication Date: 12.07.2007 International Filing Date: 14.12.2006
IPC:
H05K 1/02 (2006.01), H05K 3/46 (2006.01), H01P 3/12 (2006.01), H01P 11/00 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard, Santa Clara, CA 95052 (US) (For All Designated States Except US).
BRIST, Gary, A. [US/US]; (US) (For US Only).
HORINE, Bryce, D. [US/US]; (US) (For US Only).
HALL, Stephen, H. [US/US]; (US) (For US Only)
Inventors: BRIST, Gary, A.; (US).
HORINE, Bryce, D.; (US).
HALL, Stephen, H.; (US)
Agent: VINCENT, Lester, J.; Blakely, Sokoloff, Taylor & Zafman LLP, 12400 Wilshire Boulevard, 7th Floor, Los Angeles, CA 90025 (US)
Priority Data:
11/322,601 30.12.2005 US
Title (EN) EMBEDDED WAVEGUIDE PRINTED CIRCUIT BOARD STRUCTURE
(FR) STRUCTURE DE CARTE A CIRCUIT IMPRIME A GUIDE D'ONDES INTEGRE
Abstract: front page image
(EN)In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.
(FR)Dans certains modes de réalisation, l'invention concerne un procédé qui comporte les étapes consistant à: former un canal dans une matière de carte à circuit imprimé, plaquer le canal formé pour former au moins deux parois latérales de guide d'ondes intégré, et stratifier la matière de carte à circuit imprimé et le canal plaqué. D'autres modes et formes de réalisation sont décrits et revendiqués.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)