H | ELECTRICITY |
01 | BASIC ELECTRIC ELEMENTS |
L | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR |
2224 | Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00 |
01 | Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto |
42 | Wire connectors; Manufacturing methods related thereto |
44 | Structure, shape, material or disposition of the wire connectors prior to the connecting process |
45 | of an individual wire connector |
45001 | Core members of the connector |
45099 | Material |
451 | with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof |
45138 | the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C |
45144 | Gold (Au) as principal constituent |