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1. WO2007036999 - CIRCUIT BOARD CONNECTION STRUCTURE, CIRCUIT BOARD CONNECTION METHOD, AND PRESS TOOL FOR CIRCUIT BOARD CONNECTION

Publication Number WO/2007/036999
Publication Date 05.04.2007
International Application No. PCT/JP2005/017862
International Filing Date 28.09.2005
IPC
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
CPC
H05K 2201/091
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
091Locally and permanently deformed areas including dielectric material
H05K 2201/10977
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10954Other details of electrical connections
10977Encapsulated connections
H05K 2203/0113
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
H05K 2203/0278
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
H05K 3/305
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
305Affixing by adhesive
H05K 3/328
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
328by welding
Applicants
  • 松下電器産業株式会社 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • 鈴木 啓之 SUZUKI, Hiroyuki (UsOnly)
Inventors
  • 鈴木 啓之 SUZUKI, Hiroyuki
Agents
  • ICHIKAWA, Toshimitsu
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT BOARD CONNECTION STRUCTURE, CIRCUIT BOARD CONNECTION METHOD, AND PRESS TOOL FOR CIRCUIT BOARD CONNECTION
(FR) STUCTURE DE CONNEXION DE CARTE IMPRIMÉE, PROCÉDÉ DE CONNEXION DE CARTE IMPRIMEE, ET OUTIL DE PRESSAGE POUR CONNEXION DE CARTE IMPRIMÉE
(JA) 回路基板の接続構造、回路基板の接続方法および回路基板接続用の加圧治具
Abstract
(EN)
A circuit board connection structure enabling easier check of the connection state than conventional even if connection portions are opposed and welded with pressure, a circuit board connection method, and a press tool for circuit board connection are provided. A connection structure (10) of a circuit board has a first circuit board (11) and a second circuit board (12). First and second connection portions (17, 21) are opposed with adhesive (13) placed therebetween, so held by a press tool (25) that circuit patterns (16, 19) are in contact with each other, and heated and welded with pressure. In the connection structure (10), a pair of unadhered portions (35) are provided in a pressed area (34) of a soft base (18) with which an upper press tool (26) is brought into contact.
(FR)
Structure de connexion de carte imprimée permettant un contrôle plus facile de l'état de connexion même si les portions de connexion sont opposées et soudées sous pression, procédé de connexion de carte imprimée, et outil de pressage pour connexion de carte imprimée. Une structure de connexion (10) d’une carte imprimée possède une première carte imprimée (11) et une seconde carte imprimée (12). Une première et une seconde portions de connexion (17, 21) sont opposées avec un adhésif (13) placé entre celles-ci, maintenues ainsi par un outil de pressage (25) de telle sorte que les motifs de circuit (16, 19) soient au contact l’un de l’autre, puis chauffées et soudées sous pression. Dans la structure de connexion (10), une paire de portions non collées (35) sont disposées dans une zone comprimée (34) d’une base souple (18) avec laquelle un outil de pressage supérieur (26) est mis en contact.
(JA)
 接続部を対面配置して圧接しても、従来に比較して接続状態の良否判断を容易に行える回路基板の接続構造、回路基板の接続方法および回路基板接続用の加圧治具を提供する。  回路基板の接続構造10は、第1回路基板11と第2回路基板12とを備え、接着剤13を介して第1接続部17および第2接続部21が対面配置されるとともにと、各回路パターン16,19が互いに接触するように、第1接続部17および第2接続部21が加圧治具25に挟持されることにより加熱圧接されたものである。この回路基板の接続構造10は、軟質基材18における上側加圧治具26が接触する加圧領域34に一対の未接着部35が形成されている。
Also published as
EP05787922
EP5787922
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