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1. WO2007035761 - PLANARIZATION OF METAL LAYER OVER PHOTORESIST

Publication Number WO/2007/035761
Publication Date 29.03.2007
International Application No. PCT/US2006/036531
International Filing Date 20.09.2006
IPC
H01L 21/302 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
G03F 1/00 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
B44C 1/22 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
44DECORATIVE ARTS
CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
1Processes, not specifically provided for elsewhere, for producing decorative surface effects
22Removing surface-material, e.g. by engraving, by etching
CPC
G02B 26/0841
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
08for controlling the direction of light
0816by means of one or more reflecting elements
0833the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
0841the reflecting element being moved or deformed by electrostatic means
G03F 7/40
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
40Treatment after imagewise removal, e.g. baking
Applicants
  • TEXAS INSTRUMENTS INCORPORATED [US]/[US] (AllExceptUS)
  • DICARLO, Anthony [US]/[US] (UsOnly)
  • CHEN, Jingqiu [CN]/[US] (UsOnly)
  • HE, Yanghua [US]/[US] (UsOnly)
  • BAKER, James, C. [US]/[US] (UsOnly)
  • ROTHENBURY, David, A. [US]/[US] (UsOnly)
Inventors
  • DICARLO, Anthony
  • CHEN, Jingqiu
  • HE, Yanghua
  • BAKER, James, C.
  • ROTHENBURY, David, A.
Agents
  • FRANZ, Warren, L.
Priority Data
11/231,24920.09.2005US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PLANARIZATION OF METAL LAYER OVER PHOTORESIST
(FR) PLANARISATION D’UNE COUCHE MÉTALLIQUE SUR UN PHOTORÉSISTANT
Abstract
(EN)
The invention provides a method for planarizing a metal layer, and a method for manufacturing a micromirror element. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer (710) over a photoresist layer (510), and then planarizing the metal layer using a chemical mechanical polishing process.
(FR)
La présente invention concerne un procédé de planarisation d’une couche métallique, et un procédé de fabrication d’un élément de micromiroir. Le procédé de planarisation de la couche métallique, sans limitation, peut comprendre les étapes de disposition d'une couche métallique (710) sur une couche photorésistante (510), puis de planarisation de la couche métallique au moyen d'un processus de polissage chimique/mécanique.
Also published as
Latest bibliographic data on file with the International Bureau