Processing

Please wait...

Settings

Settings

Goto Application

1. WO2007031750 - A HEAT DISSIPATION DEVICE

Publication Number WO/2007/031750
Publication Date 22.03.2007
International Application No. PCT/GB2006/003399
International Filing Date 14.09.2006
IPC
H01L 23/40 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/4093
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4093Snap-on arrangements, e.g. clips
H01L 23/433
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 7/2049
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
2049Pressing means used to urge contact, e.g. springs
Applicants
  • TYCO ELECTRONICS UK LIMITED [GB]/[GB] (AllExceptUS)
  • PFEIFFER, Bernhard [DE]/[DE] (UsOnly)
  • DUDLEY, Neil [GB]/[GB] (UsOnly)
  • WIGGINS, Paul [GB]/[GB] (UsOnly)
Inventors
  • PFEIFFER, Bernhard
  • DUDLEY, Neil
  • WIGGINS, Paul
Agents
  • POWELL, Timothy
Priority Data
0518791.915.09.2005GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A HEAT DISSIPATION DEVICE
(FR) DISPOSITIF DE DISSIPATION THERMIQUE
Abstract
(EN)
A heat dissipating device (10) comprises a hollow housing (12) having an openable side. At least one heat-generating electronic device (14) lies within the housing (12) and at least one moveable clamping member (22) lies substantially within the interior of the housing (12). The device (10) also comprises a cover (32) that is moveable between open and closed positions in which it respectively opens and closes the openable side. Movement of the cover from the open to the closed position causes engagement between the cover (32) and the clamping member (22) so to clamp the electronic device (14) between the clamping member (22) and the housing (12), thereby promoting transfer of heat between the electronic device (14) and the housing (12).
(FR)
L'invention concerne un dispositif de dissipation thermique (10) comprenant un boîtier creux (12) possédant un côté pouvant s'ouvrir. Au moins un dispositif électronique générant de la chaleur (14) se trouve dans le boîtier (12) et au moins un élément de fixation mobile (22) se trouve sensiblement à l'intérieur du boîtier (12). Le dispositif (10) comprend également un couvercle (32) pouvant se déplacer entre des positions ouverte et fermée dans lesquelles il ouvre et ferme le côté pouvant s'ouvrir. Le mouvement du couvercle de la position ouverte à la position fermée provoque l'entrée en prise du couvercle (32) avec l'élément de fixation (22), d'où la fixation du dispositif électronique (14) entre l'élément de fixation (22) et le boîtier (12), ce qui favorise le transfert de chaleur entre le dispositif électronique (14) et le boîtier (12).
Also published as
EP06779411
EP6779411
Latest bibliographic data on file with the International Bureau