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1. WO2007031050 - CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE

Publication Number WO/2007/031050
Publication Date 22.03.2007
International Application No. PCT/DE2006/001494
International Filing Date 28.08.2006
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
H01L 23/28 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
CPC
G06K 19/077
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07728
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
0772Physical layout of the record carrier
07728the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
G06K 19/07747
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
07747at least one of the integrated circuit chips being mounted as a module
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 23/057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
053the container being a hollow construction and having an insulating ; or insulated; base as a mounting for the semiconductor body
057the leads being parallel to the base
Applicants
  • SMARTRAC IP B.V. [NL]/[NL] (AllExceptUS)
  • RIETZLER, Manfred [DE]/[DE] (UsOnly)
Inventors
  • RIETZLER, Manfred
Agents
  • VON DEN STEINEN, Axel
Priority Data
10 2005 044 216.115.09.2005DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) CHIPMODUL SOWIE VERFAHREN ZUR HERSTELLUNG EINES CHIPMODULS
(EN) CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE
(FR) MODULE A PUCE ET PROCEDE DE PRODUCTION ASSOCIE
Abstract
(DE)
Chipmodul (10) zur Herstellung kontaktloser Chipkarten mit einem Chipträger (11), der auf einem Substrat (13) mit inneren und äußeren Kontakten (17, 18) versehen ist, wobei die inneren Kontakte (17) mit Anschlussflächen einer auf dem Chipträger angeordneten Chipeinheit (12) kontaktiert sind und die äußeren Kontakte (18) zur Kontaktierung mit einer Antenne dienen, wobei die Chipeinheit (12) sandwichartig zwischen dem Substrat (13) und einer faserverstärkten Abdecklage (23) aufgenommen ist, derart, dass die Abdecklage benachbart zumindest zweier gegenüberliegender Seitenkanten der Chipeinheit (12) mit dem Substrat (13) verbunden ist, sowie Verfahren zur Herstellung eines Chipmoduls.
(EN)
Chip module (10) for producing contactless smart cards comprising a chip carrier (11), which is provided with inner and outer contacts (17, 18) on a substrate (13), wherein the inner contacts (17) are contact-connected to pads of a chip unit (12) arranged on the chip carrier and the outer contacts (18) serve for contact-connection to an antenna, wherein the chip unit (12) is accommodated in sandwich-like fashion between the substrate (13) and a fibre-reinforced covering layer (23), in such a way that the covering layer is connected to the substrate (13) adjacent to at least two opposite lateral edges of the chip unit (12), and method for producing a chip module.
(FR)
L'invention concerne un module à puce (10) permettant de produire des cartes à puces sans contact, comprenant un support pour puce (11), qui est doté de contact (17, 18) internes et externes sur un substrat, les contacts internes (17) étant en contact avec des faces de connexion d'une unité de puce (12) disposée sur le support de puce, et les contacts externes (18) servent à la mise en contact avec une antenne, l'unité puce (12) étant prise en sandwich entre le substrat (13) et une couche de revêtement (23) renforcée par des fibres, de sorte que la couche de revêtement, adjacente à au moins deux bords latéraux opposés de l'unité puce (12), est reliée au substrat. L'invention concerne également un procédé pour produire ledit module à puce.
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