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1. WO2007029133 - A METHOD OF MANUFACTURING A MICROSYSTEM, SUCH A MICROSYSTEM, A STACK OF FOILS COMPRISING SUCH A MICROSYSTEM, AN ELECTRONIC DEVICE COMPRISING SUCH A MICROSYSTEM AND USE OF THE ELECTRONIC DEVICE

Publication Number WO/2007/029133
Publication Date 15.03.2007
International Application No. PCT/IB2006/052946
International Filing Date 24.08.2006
IPC
B81C 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B01L 2200/10
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2200Solutions for specific problems relating to chemical or physical laboratory apparatus
10Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
B01L 2200/12
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2200Solutions for specific problems relating to chemical or physical laboratory apparatus
12Specific details about manufacturing devices
B01L 2300/0645
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
06Auxiliary integrated devices, integrated components
0627Sensor or part of a sensor is integrated
0645Electrodes
B01L 2300/0874
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
08Geometry, shape and general structure
0861Configuration of multiple channels and/or chambers in a single devices
0874Three dimensional network
B01L 2300/0887
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
08Geometry, shape and general structure
0887Laminated structure
B01L 2300/1827
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
18Means for temperature control
1805Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
1827using resistive heater
Applicants
  • KONINKLIJKE PHILIPS ELECTRONICS N. V. [NL]/[NL] (AllExceptUS)
  • LANGEREIS, Geert [NL]/[DE] (UsOnly)
  • WEEKAMP, Johannes Wilhelmus [NL]/[DE] (UsOnly)
  • GIESBERS, Jacobus Bernardus [NL]/[DE] (UsOnly)
Inventors
  • LANGEREIS, Geert
  • WEEKAMP, Johannes Wilhelmus
  • GIESBERS, Jacobus Bernardus
Agents
  • VOLMER, Georg
Priority Data
05108280.809.09.2005EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) A METHOD OF MANUFACTURING A MICROSYSTEM, SUCH A MICROSYSTEM, A STACK OF FOILS COMPRISING SUCH A MICROSYSTEM, AN ELECTRONIC DEVICE COMPRISING SUCH A MICROSYSTEM AND USE OF THE ELECTRONIC DEVICE
(FR) PROCEDE DE FABRICATION DE MICROSYSTEME, MICROSYSTEME, EMPILEMENT DE FEUILLES COMPRENANT CE MICROSYSTEME, DISPOSITIF ELECTRONIQUE COMPRENANT CE MICROSYSTEME ET UTILISATION DE CE DISPOSITIF ELECTRONIQUE
Abstract
(EN) The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.
(FR) L'invention concerne un procédé de fabrication d'un microsystème ainsi que ce même microsystème. Le procédé de fabrication de ce microsystème peut consister à : empiler des feuilles prétraitées (10) pourvues d'une couche conductrice (11a, 11b) sur au moins un côté ; sceller les feuilles ainsi empilées par application de chaleur et compression ; et enfin, séparer les microsystèmes de l'empilement (S). Le prétraitement des feuilles (réalisé de préférence par faisceau laser) comprend une sélection des opérations suivantes: (A) laisser la feuille intacte ; (B) décoller localement la couche conductrice ; (C) retirer la couche conductrice et vaporiser partiellement la feuille (10) ; et enfin, (D) retirer à la fois la couche conductrice et la feuille (10), de manière à former des trous dans la feuille (10). En plus de cet empilement, il est possible de former des cavités, des membranes et des porte-à-faux librement suspendus ; ce qui par conséquent, offre la possibilité de fabriquer divers microsystèmes, tels que les dispositifs MEMS et les systèmes microfluidiques.
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