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Machine translation
1. (WO2007016039) IMPROVED MICROELECTRONIC BOND PAD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/016039    International Application No.:    PCT/US2006/028708
Publication Date: 08.02.2007 International Filing Date: 25.07.2006
IPC:
H01L 23/48 (2006.01)
Applicants: TRIQUINT SEMICONDUCTOR, INC. [US/US]; 2300 NE Brookwood Parkway, Hillsboro, OR 97124 (US)
Inventors: MAHONEY, Gerard; (US).
ESSAR, Matthew; (US).
WOHLMUTH, Walter; (US).
STRUBLE, Wayne; (US)
Agent: PUGH, Joseph, A.; Triquint Semiconductor, INC., 2300 N.E. Brookwood Parkway, Hillsboro, OR 97124 (US)
Priority Data:
11/192,915 29.07.2005 US
Title (EN) IMPROVED MICROELECTRONIC BOND PAD
(FR) PASTILLE DE CONNEXION MICROÉLECTRONIQUE AMÉLIORÉE
Abstract: front page image
(EN)One embodiment of an integrated circuit (30) includes a substrate (38), an electrical device (34) positioned above the substrate, and a bond bad (72) positioned above and aligned along a vertical axis with the electrical device such that the electrical device is positioned between the substrate and the bond pad.
(FR)Un mode de réalisation d’un circuit intégré (30) comprend un substrat (38), un dispositif électrique (34) disposé au-dessus du substrat, et une pastille de connexion (72) disposée au-dessus et alignée le long d'un axe vertical avec le dispositif électrique de sorte que le dispositif électrique soit intercalé entre le substrat et la pastille de connexion.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)