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1. (WO2007013428) COPPER ALLOY EXTRUDED MATERIAL AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/013428    International Application No.:    PCT/JP2006/314628
Publication Date: 01.02.2007 International Filing Date: 25.07.2006
IPC:
C22C 1/04 (2006.01), B22F 1/00 (2006.01), B22F 3/20 (2006.01), C22C 1/05 (2006.01), C22C 9/01 (2006.01), C22C 9/04 (2006.01)
Applicants: SAN-ETSU METALS Co., Ltd. [JP/JP]; 4-1, Yoshihisa 1-chome, Takaoka-shi, Toyama 9330002 (JP) (For All Designated States Except US).
KOSAKA, Yoshiharu [JP/JP]; (JP) (For US Only).
OKUYAMA, Masanori [JP/JP]; (JP) (For US Only).
KOJIMA, Akimichi [JP/JP]; (JP) (For US Only).
KONDOH, Katsuyoshi [JP/JP]; (JP) (For US Only)
Inventors: KOSAKA, Yoshiharu; (JP).
OKUYAMA, Masanori; (JP).
KOJIMA, Akimichi; (JP).
KONDOH, Katsuyoshi; (JP)
Agent: ITOH, Hidehiko; IMY INTERNATIONAL PATENT OFFICE Kyowa ShimanouchiBldg. 21-19, Shimanouchi 1-chome, Chuo-ku Osaka-shi, Osaka 5420082 (JP)
Priority Data:
2005-219151 28.07.2005 JP
Title (EN) COPPER ALLOY EXTRUDED MATERIAL AND METHOD FOR PRODUCING SAME
(FR) MATÉRIAU EXTRUDÉ EN ALLIAGE DE CUIVRE ET SON PROCÉDÉ DE FABRICATION
(JA) 銅合金押出材およびその製造方法
Abstract: front page image
(EN)Disclosed is a copper alloy extruded material obtained by extruding a copper alloy powder solidified billet. Old grain boundaries remain inside this copper alloy extruded material.
(FR)La présente invention concerne un matériau extrudé en alliage de cuivre obtenu en extrudant une billette solidifiée à base de poudre d’alliage de cuivre. Les contours des vieux grains restent à l’intérieur du matériau extrudé en alliage de cuivre.
(JA)銅合金押出材は、銅合金粉末固化体ビレットを押出し加工して得られるものであって、内部に旧粉末粒界を残存させている。  
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)