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Machine translation
1. (WO2007012992) A PACKAGE AND MANUFACTURING METHOD FOR A MICROELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/012992    International Application No.:    PCT/IB2006/052385
Publication Date: 01.02.2007 International Filing Date: 13.07.2006
IPC:
H01L 31/0203 (2006.01), B81B 7/00 (2006.01), H01L 23/31 (2006.01), H05K 3/00 (2006.01), H05K 3/28 (2006.01), H01L 21/56 (2006.01), B81C 5/00 (2006.01), H01L 33/00 (2006.01), H01L 27/146 (2006.01), G06K 9/00 (2006.01)
Applicants: NXP B.V. [NL/NL]; High Tech Campus 60, NL-5656 AG Eindhoven (NL) (For All Designated States Except US).
JADUCANA, Dandy, N. [PH/PH]; (NL) (For US Only).
CATALLA, Jonathan, S. [PH/PH]; (NL) (For US Only).
LACSON, Nhoy [PH/PH]; (NL) (For US Only).
AMISTOSO, Jose, O. [PH/PH]; (NL) (For US Only)
Inventors: JADUCANA, Dandy, N.; (NL).
CATALLA, Jonathan, S.; (NL).
LACSON, Nhoy; (NL).
AMISTOSO, Jose, O.; (NL)
Agent: WHITE, Andrew; NXP Semiconductors, Intellectual Property Department, Cross Oak Lane, Redhill, Surrey RH1 5HA (GB)
Priority Data:
05106971.4 28.07.2005 EP
Title (EN) A PACKAGE AND MANUFACTURING METHOD FOR A MICROELECTRONIC COMPONENT
(FR) EMBALLAGE ET PROCEDE DE FABRICATION POUR UN COMPOSANT MICROELECTRONIQUE
Abstract: front page image
(EN)The present invention relates to A package (50,70) for a microelectronic component, comprising: a carrier element (12) having a first side (16) that comprises conductor lines (14); - a microelectronic component (20) having a first surface (24) and a second surface (23) facing away from the first surface; the microelectronic component with said second surface mounted on said first side and connected to the conductor lines via bonding wires (28); a polymeric encapsulation material (30) encapsulating the bonding wires and exposing a central zone (40) of said first surface (24), the encapsulation material comprising an outer edge (36) at said first side and an inner edge (38) at said first surface; a dam (42,44) abutting to the encapsulation material; wherein the dam (44) comprises a step-shaped surface transition (46) at said first side (16), the surface transition abutting on said outer edge (36). The dam (44) influences the forming of the outer (36) and the inner edge (38) during manufacturing the encapsulation material (30) and enlarges the area of the central zone (40). The present invention also relates to a method of manufacturing such a package for a microelectronic component.
(FR)L'invention concerne (A) un emballage (50, 70) conçu pour un composant microélectronique, qui comprend: un élément support (12) ayant un premier côté (16) comprenant des fils conducteurs (14); un composant microélectronique (20) ayant une première surface (24) et une seconde surface (23) regardant à distance la première surface; le composant microélectronique ayant la seconde surface montée sur ledit premier côté et connectée aux fils conducteurs via des câbles de liaison (28); un matériau d'encapsulation polymère (30) qui encapsule les câbles de liaison et expose une zone centrale (40) de ladite première surface (24), le matériau d'encapsulation comprenant un bord externe (36) sur ledit premier côté et un bord interne (38) sur ladite première surface; une digue (42, 44) venant en butée contre le matériau d'encapsulation. Ladite digue (44) comprend une transition superficielle en forme d'escalier (46) sur ledit premier côté (16), la transition superficielle venant en butée contre ledit bord externe (36). La digue (44) influence la formation du bord externe (36) et du bord interne (38) lors de la fabrication du matériau d'encapsulation (30) et agrandit la surface de la zone centrale (40). L'invention concerne également un procédé de fabrication d'un tel emballage destiné à un composant microélectronique.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)