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1. (WO2007011604) METHOD OF SUPPRESSING DISTORTION OF A WORKING LASER BEAM OF A LASER LINK PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/011604 International Application No.: PCT/US2006/027032
Publication Date: 25.01.2007 International Filing Date: 11.07.2006
IPC:
H01L 21/027 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
ELECTRO SCIENTIFIC INDUSTRIES, INC. [US/US]; 13900 Nw Science Park Drive Portland, Oregon 97229-5497, US (AllExceptUS)
HEMENWAY, David Martin [US/US]; US (UsOnly)
NILSEN, Brady [US/US]; US (UsOnly)
LO, Ho Wai [US/US]; US (UsOnly)
GRANT, Keith [US/US]; US (UsOnly)
Inventors:
HEMENWAY, David Martin; US
NILSEN, Brady; US
LO, Ho Wai; US
GRANT, Keith; US
Agent:
ANGELLO, Paul S.; Stoel Rives, LLP 900 S.W. Fifth Avenue Suite 2600 Portland, Oregon 97204, US
Priority Data:
11/440,69624.05.2006US
60/700,03115.07.2005US
Title (EN) METHOD OF SUPPRESSING DISTORTION OF A WORKING LASER BEAM OF A LASER LINK PROCESSING SYSTEM
(FR) PROCEDE PERMETTANT DE SUPPRIMER LA DISTORSION D'UN FAISCEAU LASER DE TRAVAIL D'UN SYSTEME DE TRAITEMENT PAR LIAISON LASER
Abstract:
(EN) A method of suppressing distortion of a working laser beam (12') directed for incidence on a target specimen (14) presented for processing by a laser link processing system (100) uses a spatial filter (102) to remove stray light-induced distortion from the working laser beam.
(FR) La présente invention concerne un procédé permettant de supprimer la distorsion d'un faisceau laser de travail (12') orienté vers un spécimen cible (14) présenté de manière à être traité par un système de traitement par liaison laser (100) au moyen d'un filtre spatial (102) afin de supprimer une distorsion induite par une lumière parasite d'un faisceau laser de travail.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080026163JP2009501088CN101223628