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1. (WO2007011544) ELECTRONICALLY CONNECTING SUBSTRATE WITH ELECTRICAL DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/011544 International Application No.: PCT/US2006/026446
Publication Date: 25.01.2007 International Filing Date: 29.06.2006
IPC:
H01L 21/60 (2006.01) ,B23K 20/00 (2006.01) ,H01L 21/603 (2006.01) ,H01L 21/607 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
603
involving the application of pressure, e.g. thermo-compression bonding
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
607
involving the application of mechanical vibrations, e.g. ultrasonic vibrations
Applicants:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; Hewlett-Packard Company Intellectual Property Administration 20555 S.H. 249 Houston, Texas 77070, US (AllExceptUS)
CRAIG, David M. [US/US]; US (UsOnly)
CHEN, Chien-Hua [US/US]; US (UsOnly)
Inventors:
CRAIG, David M.; US
CHEN, Chien-Hua; US
Agent:
MYERS, Timothy F. ; Hewlett-Packard Company Intellectual Property Administration P.O. Box 272400 Mail Stop 35 Fort Collins, Colorado 80527-2400, US
Priority Data:
11/181,47914.07.2005US
Title (EN) ELECTRONICALLY CONNECTING SUBSTRATE WITH ELECTRICAL DEVICE
(FR) CONNEXION ELECTRIQUE D'UN SUBSTRAT A UN DISPOSITIF ELECTRIQUE
Abstract:
(EN) A substrate is electrically connected with an electrical device mounted on the substrate (100). A ball bond is formed between a first end of a wire and a bonding pad of the substrate (106). A reverse-motion loop is formed within the wire (108). A bond is formed between a second end of the wire and a bonding pad of the electrical device (118).
(FR) Un substrat est connecté électriquement à un dispositif électrique monté sur ce substrat (100). Une connexion boule est formée entre une première extrémité d'un fil et un plot de connexion du substrat (106). Une boucle à mouvement inverse est formée dans le fil (108). Une liaison est formée entre une seconde extrémité du fil et un plot de connexion du dispositif électrique (118).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1908102