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1. (WO2007011158) POLISHING PAD CONTAINING INTERPENETRATING LIQUIFIED VINYL MONOMER NETWORK WITH POLYURETHANE MATRIX THEREIN
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/011158 International Application No.: PCT/KR2006/002826
Publication Date: 25.01.2007 International Filing Date: 19.07.2006
IPC:
C08J 7/00 (2006.01) ,C08G 18/83 (2006.01) ,B24B 37/00 (2006.01) ,C09K 3/14 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7
Chemical treatment or coating of shaped articles made of macromolecular substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18
Polymeric products of isocyanates or isothiocyanates
06
with compounds having active hydrogen
83
Chemically modified polymers
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
Applicants:
SKC CO., LTD. [KR/KR]; 633 Jeongja-1-dong Jangan-gu Suwon Kyungki-do 440-745, KR (AllExceptUS)
PARK, In-Ha [KR/KR]; KR (UsOnly)
LEE, Ju-Yeol [KR/KR]; KR (UsOnly)
JUN, Sung-Min [KR/KR]; KR (UsOnly)
Inventors:
PARK, In-Ha; KR
LEE, Ju-Yeol; KR
JUN, Sung-Min; KR
Agent:
C&S LOGOS PATENT AND LAW OFFICE; 13th Floor, Seocho-Pyunghwa Bldg. 1451-34 Seocho-dong, Seocho-gu Seoul 137-070, KR
Priority Data:
10-2005-006575620.07.2005KR
Title (EN) POLISHING PAD CONTAINING INTERPENETRATING LIQUIFIED VINYL MONOMER NETWORK WITH POLYURETHANE MATRIX THEREIN
(FR) TAMPON DE POLISSAGE CONTENANT UN RÉSEAU MONOMÈRE DE VINYLE LIQUÉFIÉ INTERPÉNÉTRANT AVEC UNE MATRICE POLYURÉTHANE À L'INTÉRIEUR
Abstract:
(EN) Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.
(FR) L'invention concerne un tampon de polissage en polyuréthane. Plus spécifiquement, la présente invention concerne un tampon de polissage en polyuréthane ayant une structure de réseau interpénétrant d'un polymère vinylique avec une matrice polyuréthane via polymérisation de radical et ayant ni pore ni bulle de gaz. Le tampon de polissage en polyuréthane ayant une structure de réseau interpénétrant d'un polymère vinylique présente une dispersibilité uniforme et des modifications réduites de dureté du tampon en uréthane dues à la chaleur et à la boue, conduisant ainsi à une absence de détérioration de l'efficacité de polissage due à la chaleur d'abrasion et de la solubilité dans la boue au cours du polissage, et permet également un fonctionnement en polissage à température élevée. En outre, selon la présente invention, la structure de réseau interpénétrant conduit à une amélioration du taux de polissage et des performances d'abrasion, augmentant ainsi de manière significative la durée de service du tampon de polissage.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: Korean (KO)
Also published as:
JP2009501648US20090077899CN101228216DE112006001927