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1. (WO2007011063) PRESSURE-SENSITIVE ADHESIVE SHEET
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/011063 International Application No.: PCT/JP2006/314828
Publication Date: 25.01.2007 International Filing Date: 20.07.2006
IPC:
C09J 7/02 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
Applicants:
LINTEC CORPORATION [JP/JP]; 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP (AllExceptUS)
KATO, Kiichiro [JP/JP]; JP (UsOnly)
TOMINO, Tadahiro [JP/JP]; JP (UsOnly)
SUZUKI, Tomomi [JP/JP]; JP (UsOnly)
Inventors:
KATO, Kiichiro; JP
TOMINO, Tadahiro; JP
SUZUKI, Tomomi; JP
Agent:
HAYAKAWA, Yuzi ; Arcadia Patent Firm, Suite 501, Hikawa-Annex No.2 9-5, Akasaka 6-chome Minato-ku, Tokyo 1070052, JP
Priority Data:
2005-21046520.07.2005JP
2006-10138503.04.2006JP
Title (EN) PRESSURE-SENSITIVE ADHESIVE SHEET
(FR) FEUILLE ADHÉSIVE SENSIBLE À LA PRESSION
Abstract:
(EN) In a pressure-sensitive adhesive sheet 1 that comprises a base material 11 and a pressure-sensitive adhesive layer 12, and has formed therein by thermal processing a plurality of through holes 2 passing through one surface to the other surface of the pressure-sensitive adhesive sheet 1, as the base material 11, one is used for which, upon heating at a heating rate of 20 °C/min under a nitrogen atmosphere, the temperature at a thermal decomposition peak where the mass reduction is greatest is not more than 450 °C, or the difference between the temperature at the thermal decomposition peak and the temperature at a melting peak is not more than 250 °C. According to this pressure-sensitive adhesive sheet 1, the appearance of the pressure-sensitive adhesive sheet 1 is not marred by the through holes 2 formed by the thermal processing.
(FR) Dans une feuille adhésive sensible à la pression 1 comprenant un matériau de base 11 et une couche adhésive sensible à la pression 12, avec formés dans celle-ci par traitement thermique une pluralité de trous traversants 2 passant à travers une surface jusqu’à l’autre surface de la feuille adhésive sensible à la pression 1, comme matériau de base 11, on utilise un matériau qui lors d’un chauffage à une vitesse de 20 °C/min sous atmosphère d’azote, présente une température au niveau d’un pic de décomposition thermique où la réduction en masse est maximale ne dépassant pas 450 °C, ou bien une différence entre la température au niveau du pic de décomposition thermique et la température en un pic de fusion ne dépassant pas 250 °C. Avec cette feuille adhésive sensible à la pression 1, l’aspect de la feuille adhésive sensible à la pression 1 n’est pas entaché par les trous traversants 2 formés pas le traitement thermique.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080042830EP1913110BRPI0613637-0RU02402586US20090053467CN101248150
CA2615632AU2006270740IN363/DELNP/2008