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1. (WO2007010927) SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/010927 International Application No.: PCT/JP2006/314240
Publication Date: 25.01.2007 International Filing Date: 19.07.2006
IPC:
B23K 35/26 (2006.01) ,B23K 1/08 (2006.01) ,C22C 13/00 (2006.01) ,H05K 3/24 (2006.01) ,H05K 3/34 (2006.01) ,B23K 101/38 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
26
with the principal constituent melting at less than 400C
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
08
Soldering by means of dipping in molten solder
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
13
Alloys based on tin
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
24
Reinforcing of the conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
36
Electric or electronic devices
38
Conductors
Applicants:
株式会社日本スペリア社 Nihon Superior Sha Co., Ltd. [JP/JP]; 〒5640063 大阪府吹田市江坂町1丁目16番15号 Osaka 16-15, Esaka-cho 1-chome, Suita-shi, Osaka 5640063, JP (AllExceptUS)
西村 哲郎 NISHIMURA, Tetsuro [JP/JP]; JP (UsOnly)
Inventors:
西村 哲郎 NISHIMURA, Tetsuro; JP
Agent:
濱田 俊明 HAMADA, Toshiaki; 〒5410059 大阪府大阪市中央区博労町1丁目8番8号 堺筋MSビル2階 中野・濱田特許事務所 Osaka NAKANO & HAMADA Sakaisuji MS Building 2nd floor, 8-8, Bakuro-machi 1-chome Chuo-ku, Osaka-shi Osaka 5410059, JP
Priority Data:
2005-20813419.07.2005JP
Title (EN) SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
(FR) BRASAGE EXEMPT DE PLOMB POUR APPORT SUPPLÉMENTAIRE ET PROCÉDÉ DE RÉGULATION DE CONCENTRATION DE Cu ET DE CONCENTRATION DE Ni DANS UN BAIN DE BRASAGE
(JA) 追加供給用鉛フリーはんだ及びはんだ浴中のCu濃度及びNi濃度調整方法
Abstract:
(EN) A solder free from lead for additional supply to control the Cu concentration and Ni concentration in solder bath which sharply vary depending upon the particularity of post-process; and a method of regulating the Cu concentration and Ni concentration in solder bath under such particular conditions. A lead-free solder composed mainly of Sn wherein at least Ni is contained in an amount of 0.01 to 0.5 mass% is supplied to a solder bath employed for a work of printed board, copper lead wire or copper tape furnished with a copper foil to be processed by an air knife or a die after soldering. By charging of the lead-free solder of this composition, the solder concentration in solder bath having been sharply changed by post-process HASL unit or die is rapidly returned into an appropriate concentration range.
(FR) L’invention concerne un brasage exempt de plomb pour apport supplémentaire afin de contrôler la concentration de Cu et la concentration de Ni dans un bain de brasage qui varient énormément selon la particularité de post-processus ; et un procédé de régulation de la concentration de Cu et de la concentration de Ni dans un bain de brasage dans de telles conditions particulières. Un brasage sans plomb composé principalement de Sn contenant au moins du Ni dans une quantité allant de 0,01 à 0,5 % en masse est versé dans un bain de brasage employé pour l’usinage de cartes imprimées, de fils de cuivre ou de bandes de cuivre pourvues d’un film de cuivre à traiter par un couteau pneumatique ou une filière après brasage. Le chargement du brasage sans plomb de cette composition permet de ramener rapidement la concentration de brasage dans un bain de brasage après un brusque changement par post-processus de l’unité HASL ou d’une filière dans une fourchette de concentration appropriée.
(JA)  後工程の特殊性により、急激に変動するはんだ浴中のCu濃度及びNi濃度を管理するための追加供給用鉛フリーはんだ、及びそのような特殊な状況下のはんだ浴中のCu濃度及びNi濃度調整方法である。はんだ付け後にエアナイフ又はダイスにより処理される銅箔を有するプリント基板、銅リード線、又は銅テープからなるワークに用いるはんだ浴に対して、Snが主成分であり、少なくともNiを0.01質量%以上0.5質量%以下含有する鉛フリーはんだを供給する。この組成の鉛フリーはんだを投入することにより、後工程のHASL装置やダイスにより急激に変化したはんだ浴中のはんだ濃度を適正な濃度範囲に迅速に戻す。
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
VN16909EP1911543JPWO2007010927US20090289102ES2382841RU0002410222
CN101223002ID048.0992TH84352